Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
CD-02-05-DO4

CD-02-05-DO4

Wakefield-Vette

THERM PAD DO-4 0.625OD/0.203"ID

500

CD-02-05-025

CD-02-05-025

Wakefield-Vette

THERM PAD 25.4MMX25.4MM ORANGE

54

PL-05-3-1016

PL-05-3-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GREEN

249

CD-02-05-C-34

CD-02-05-C-34

Wakefield-Vette

THERM PAD 1.319" X 1.319"

170

PL-05-3-1016-H

PL-05-3-1016-H

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GREEN

249

CD-02-05-66

CD-02-05-66

Wakefield-Vette

THERM PAD TO-66 2 PIN

389

CD-02-05-247

CD-02-05-247

Wakefield-Vette

THERM PAD 24.13MMX19.05MM ORANGE

12668

PL-1-5-1016-H

PL-1-5-1016-H

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD

51

175-6-240P

175-6-240P

Wakefield-Vette

THERM PAD 19.1MMX12.7MM GRAY

17523

CD-02-05-C-20

CD-02-05-C-20

Wakefield-Vette

THERM PAD 0.768" X 0.768"

430

PL-05-1-1016

PL-05-1-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GRAY

242

PL-2-5-1016

PL-2-5-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD

194

PL-2-3-1016-H

PL-2-3-1016-H

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GREEN

237

CD-02-05-264

CD-02-05-264

Wakefield-Vette

THERM PAD 26.67MMX21.59MM ORANGE

0

173-7-240A

173-7-240A

Wakefield-Vette

THERM PAD 19.1MMX12.7MM W/ADH

4966

PL-2-5-1016-H

PL-2-5-1016-H

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD

257

PL-1-1-1016

PL-1-1-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GRAY

229

CD-02-05-190

CD-02-05-190

Wakefield-Vette

THERM PAD 254MMX196.85MM ORANGE

86

173-9-1212P

173-9-1212P

Wakefield-Vette

THERM PAD 304.8MMX304.8MM GRAY

0

PL-05-3-254-H

PL-05-3-254-H

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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