Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
CD-02-05-C-22

CD-02-05-C-22

Wakefield-Vette

THERM PAD 0.846" X 0.846"

216

CD-02-05-DO4-5

CD-02-05-DO4-5

Wakefield-Vette

THERM PAD DO4/5 0.800OD/0.260"ID

489

PL-05-5-254

PL-05-5-254

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GOLD

54

CD-02-05-218

CD-02-05-218

Wakefield-Vette

THERM PAD TO-218 PAD WITH HOLE

208

CD-02-05-LED-1

CD-02-05-LED-1

Wakefield-Vette

THERM PAD LED 1 INCH OD CIRCLE

419

CD-02-05-BRI-225

CD-02-05-BRI-225

Wakefield-Vette

THERM PAD BRIDGE RECT 2.25X1.75"

180

PL-1-5-254

PL-1-5-254

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GOLD

213

CD-02-05-220-3

CD-02-05-220-3

Wakefield-Vette

THERM PAD TRIPLE TO-220 3 HOLES

489

CD-02-05-247-2

CD-02-05-247-2

Wakefield-Vette

THERM PAD DUAL TO-247 2 HOLES

261

PL-2-3-1016

PL-2-3-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GREEN

0

CD-02-05-220

CD-02-05-220

Wakefield-Vette

THERM PAD 17.78MMX12.7MM ORANGE

765

CD-02-05-C-26

CD-02-05-C-26

Wakefield-Vette

THERM PAD 1.003" X 1.003"

452

CD-02-05-C-49

CD-02-05-C-49

Wakefield-Vette

THERM PAD 1.909" X 1.909"

233

175-6-280P

175-6-280P

Wakefield-Vette

THERM PAD 21.79MMX18.39MM GRAY

2377

CD-02-05-3-2

CD-02-05-3-2

Wakefield-Vette

THERM PAD TO-3 2 PIN

210

PL-2-1-1016

PL-2-1-1016

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GRAY

179

CD-02-05-C-39

CD-02-05-C-39

Wakefield-Vette

THERM PAD 1.516" X 1.516"

89

CD-02-05-LED-2

CD-02-05-LED-2

Wakefield-Vette

THERM PAD LED 2 INCH OD CIRCLE

3

PL-1-3-254-H

PL-1-3-254-H

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN

204

PL-05-5-1016-H

PL-05-5-1016-H

Wakefield-Vette

THERM PAD 101.6MMX101.6MM GOLD

381

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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