Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
175-6-260P

175-6-260P

Wakefield-Vette

THERM PAD 25.4MMX19.05MM GRAY

0

173-7-1212P

173-7-1212P

Wakefield-Vette

THERM PAD 304.8MMX304.8MM GRAY

0

175-6-250P

175-6-250P

Wakefield-Vette

THERM PAD 22MMX16.51MM GRAY

0

PPIM00007

PPIM00007

Wakefield-Vette

THERMAL TAPE 1.32" X 1.32"

0

PPIM00004

PPIM00004

Wakefield-Vette

THERMAL TAPE .77" X .77"

0

PPIM00005

PPIM00005

Wakefield-Vette

THERMAL TAPE 1.00" X 1.00"

0

PPIM00006

PPIM00006

Wakefield-Vette

THERMAL TAPE 1.09" X1.09"

0

173-9-1212A

173-9-1212A

Wakefield-Vette

THERM PAD 304.8MMX304.8MM W/ADH

0

175-6-66P

175-6-66P

Wakefield-Vette

THERM PAD 152.4MMX152.4MM GRAY

0

PPIM00008

PPIM00008

Wakefield-Vette

THERMAL TAPE 1.52" X 1.52"

0

175-6-410P

175-6-410P

Wakefield-Vette

THERM PAD 15.87MMX5.08MM GRAY

0

175-6-510P

175-6-510P

Wakefield-Vette

THERM PAD 20.32MMX6.6MM GRAY

0

175-6-210P

175-6-210P

Wakefield-Vette

THERM PAD 17.45MMX14.27MM GRAY

0

173-9-210P

173-9-210P

Wakefield-Vette

THERM PAD 17.45MMX14.27MM GRAY

0

PPIM00003

PPIM00003

Wakefield-Vette

THERMAL TAPE .70" X .70"

0

175-6-330P

175-6-330P

Wakefield-Vette

THERM PAD 41.91MMX28.96MM GRAY

0

173-7-230P

173-7-230P

Wakefield-Vette

THERM PAD 19.05MMX12.7MM GRAY

0

174-9-1212P

174-9-1212P

Wakefield-Vette

THERM PAD 304.8MMX304.8MM TAN

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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