Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-AL375-150-150-3.0-1A

TG-AL375-150-150-3.0-1A

t-Global Technology

THERM PAD 150MMX150MM W/ADH GRAY

18

EYG-R1014ZLAD

EYG-R1014ZLAD

Panasonic

THERM PAD 97.8X138X0.25MM GRAY

10

TG-A1250-30-30-3.0

TG-A1250-30-30-3.0

t-Global Technology

THERM PAD A1250 30X30X3MM

0

SP400-0.009-00-51

SP400-0.009-00-51

Henkel / Bergquist

THERM PAD 17.45MMX14.27MM GRAY

1802

TG-AL373-13-7-1.0-0

TG-AL373-13-7-1.0-0

t-Global Technology

THERM PAD 13MMX7MM YELLOW

1154

60-12-4305-1674

60-12-4305-1674

Parker Chomerics

CHO-THERM 1674 0.010" TO-3 ADH

287

T69-225-225-0.07-0

T69-225-225-0.07-0

t-Global Technology

THERM PAD 225MMX225MM GRAY

0

A17713-03

A17713-03

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM BLUE

31

TG-A3500-5-5-5.0

TG-A3500-5-5-5.0

t-Global Technology

THERMAL PAD 5X5MM YELLOW

0

120.6MM-120.6MM-25-8810

120.6MM-120.6MM-25-8810

3M

THERM PAD 120.6MMX120.6MM 1=25PK

0

PL-2-3-254-H

PL-2-3-254-H

Wakefield-Vette

THERM PAD 25.4MMX25.4MM GREEN

0

A15036-110

A15036-110

Laird - Performance Materials

THERM PAD 41.91MMX28.96MM W/ADH

0

PK504-320-320-1.5

PK504-320-320-1.5

THERMAL PAD, SHEET 320X320MM, TH

1

DTT65-160-160-2.5

DTT65-160-160-2.5

THERMAL PAD, SHEET 160X160MM, TH

24

3M 8805 SQUARE-17MM-250

3M 8805 SQUARE-17MM-250

3M

THERM PAD 17MMX17MM W/ADH 250/PK

0

TG-A1660-125-125-0.5

TG-A1660-125-125-0.5

t-Global Technology

THERMAL PAD 125X125MM GREY

50

TG-A4040-100-100-3.0

TG-A4040-100-100-3.0

t-Global Technology

THERM PAD 100MMX100MM BLUE

0

TG-A486G-20-20-4-1A

TG-A486G-20-20-4-1A

t-Global Technology

THERM PAD 20MMX20MM W/ADH GRAY

2496

TG-AL375-150-150-0.5-1A

TG-AL375-150-150-0.5-1A

t-Global Technology

THERM PAD 150MMX150MM W/ADH GRAY

107

GP2500S20-0.080-02-0816

GP2500S20-0.080-02-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM YELLOW

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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