Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
8926-025 12

8926-025 12" X 12"-5

3M

THERM PAD 304.8 X 304.8MM 1=1

26

K4-0.006-AC-54

K4-0.006-AC-54

Henkel / Bergquist

THERM PAD 19.05MMX12.7MM W/ADH

0

36.83MM-33.02MM-25-8810

36.83MM-33.02MM-25-8810

3M

THERM PAD 36.8MMX33.02MM 1=25/PK

0

A14556-01

A14556-01

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM BLUE

43

TG-A373F-320-320-0.45-1A

TG-A373F-320-320-0.45-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH YLW

0

CD-02-05-C-54

CD-02-05-C-54

Wakefield-Vette

THERM PAD 2.106" X 2.106"

9

TG-A3500-15-15-0.5

TG-A3500-15-15-0.5

t-Global Technology

THERM PAD A3500 15X15X0.5MM

0

60-11-D397-T500

60-11-D397-T500

Parker Chomerics

CHO-THERM T500 TO-220 0.010"

490

CD-02-05-247-3

CD-02-05-247-3

Wakefield-Vette

THERM PAD TRIPLE TO-247 3 HOLES

237

TG-A2030-30-30-2.0

TG-A2030-30-30-2.0

t-Global Technology

THERM PAD 30MMX30MM WHITE

533

TG-A373S-100-100-3.0-1A

TG-A373S-100-100-3.0-1A

t-Global Technology

THERM PAD 100MMX100MM W/ADH YLW

0

DC0022/03-TG-A373F-0.25-2A

DC0022/03-TG-A373F-0.25-2A

t-Global Technology

THERM PAD 63.5MMX50.8MM W/ADH

83

TG-A486A-320-320-5.0-0

TG-A486A-320-320-5.0-0

t-Global Technology

THERM PAD 320MMX320MM HENNA

8

AF500-204005

AF500-204005

CUI Devices

THERM PAD 20MMX40MM 1 SHT=100PC

2

EYG-R0611ZRWH

EYG-R0611ZRWH

Panasonic

THERM PAD 60X106X0.35MM GRAY

0

TG-A486A-320-320-3.0-0

TG-A486A-320-320-3.0-0

t-Global Technology

THERM PAD 320MMX320MM HENNA

0

EYG-A091201KV

EYG-A091201KV

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

T-WORK7000-160-160-2.0

T-WORK7000-160-160-2.0

THERMAL PAD, SHEET 160X160MM, TH

35

TG-A486A-150-150-2.0-0

TG-A486A-150-150-2.0-0

t-Global Technology

THERM PAD 150MMX150MM HENNA

0

TG-AH482-150-150-3.0-0

TG-AH482-150-150-3.0-0

t-Global Technology

THERM PAD 150MMX150MM RED

20

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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