Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A2200-20-10-2.0

TG-A2200-20-10-2.0

t-Global Technology

THERMAL PAD 20X10MM GREY

0

EYG-Y0912QN3S

EYG-Y0912QN3S

Panasonic

THERM PAD 115MMX90MM W/ADH WHITE

0

5590PI-O2

5590PI-O2

3M

THERM PAD 350MMX230MM BROWN

89

TI900-20-10-0.12-0

TI900-20-10-0.12-0

t-Global Technology

THERM PAD 20MMX10MM WHITE

1199

TP-GP01-D

TP-GP01-D

THERMAL PAD 80X40X2.0MM 12 WATT

0

PCM20Y-200-150-0.13

PCM20Y-200-150-0.13

t-Global Technology

THERM PAD 200MMX150MM YELLOW

21

EYG-S0811ZLGH

EYG-S0811ZLGH

Panasonic

THERM PAD 113MMX80MM GRAY

18

GPEMI1.0-0.060-01-0816

GPEMI1.0-0.060-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BLACK

0

3M 8805 SQUARE-28MM-100

3M 8805 SQUARE-28MM-100

3M

THERM PAD 28MMX28MM W/ADH 100/PK

0

TG-A373F-640-320-0.45-1A

TG-A373F-640-320-0.45-1A

t-Global Technology

THERM PAD 640MMX320MM W/ADH YLW

0

LI98-50M-320-0.15

LI98-50M-320-0.15

t-Global Technology

THERM PAD 50MX320MM W/ADH WHITE

0

A15405-01

A15405-01

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

314

TG-A486G-320-320-0.5-2A

TG-A486G-320-320-0.5-2A

t-Global Technology

THERM PAD 320MMX320MM W/ADH GRAY

17

TG-AH486-320-320-2.0-0

TG-AH486-320-320-2.0-0

t-Global Technology

THERM PAD 320MMX320MM GRAY

10

60-11-D394-T500

60-11-D394-T500

Parker Chomerics

CHO-THERM T500 TO-220 0.010"

481

LI2000-150-150-0.25

LI2000-150-150-0.25

t-Global Technology

THERM PAD 150MMX150MM W/ADH WHT

29

EYG-R1113ZLMB

EYG-R1113ZLMB

Panasonic

THERM PAD 106X132X0.25MM GRAY

10

A10462-02

A10462-02

Laird - Performance Materials

THERM PAD 457.2MMX304.8MM W/ADH

0

EYG-S0404ZLMP

EYG-S0404ZLMP

Panasonic

THERM PAD 38MMX36MM GRAY

1

TG-A486A-150-150-5.0-0

TG-A486A-150-150-5.0-0

t-Global Technology

THERM PAD 150MMX150MM HENNA

12

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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