Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A38KF-385-285-5.0

TG-A38KF-385-285-5.0

t-Global Technology

THERMAL PAD 385X285MM BLUE

10

A17653-05

A17653-05

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM PINK

4

8810-22

8810-22"-36YRDS

3M

THERM TAPE 32.92MX558.8MM

13

A15428-003

A15428-003

Laird - Performance Materials

THERM PAD 45.21MMX31.75MM TAN

0

T62-1-110-80-0.16

T62-1-110-80-0.16

t-Global Technology

THERM PAD 110MMX80MM BLACK

0

TG-A1660-40-40-0.5

TG-A1660-40-40-0.5

t-Global Technology

THERM PAD A1660 40X40X0.5MM

0

A17747-11

A17747-11

Laird - Performance Materials

TFLEX P3110 9.00X9.00IN

0

TG-A4500-30-30-1.5

TG-A4500-30-30-1.5

t-Global Technology

THERM PAD A4500 30X30X1.5MM

162

TG-A6050-7.2-6.3-1.0

TG-A6050-7.2-6.3-1.0

t-Global Technology

THERM PAD 7.2MMX6.3MM RED

0

A17883-04

A17883-04

Laird - Performance Materials

TFLEX HD81000 9" X 9"

0

SOFTFLEX-B016-30-01-4000-2000

SOFTFLEX-B016-30-01-4000-2000

Aavid

PAD SOFTFLEX B016 3MM 400X200MM

0

TGF50-07870787-020

TGF50-07870787-020

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM WHITE

14

A17916-16

A17916-16

Laird - Performance Materials

TFLEX B2160 9X9IN

86

TG-A373S-640-320-10.0-0

TG-A373S-640-320-10.0-0

t-Global Technology

THERM PAD 640MMX320MM YELLOW

2

A15959-12

A15959-12

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

73

TG-A6200-40-40-0.5

TG-A6200-40-40-0.5

t-Global Technology

THERM PAD A6200 40X40X0.5MM

179

TG-A2030-24-21.01-2.0

TG-A2030-24-21.01-2.0

t-Global Technology

THERM PAD 24MMX21.01MM WHITE

206

SF500G-707005

SF500G-707005

CUI Devices

THERMAL INTERFACE MATERIAL, SF50

0

EYG-R0507ZRML

EYG-R0507ZRML

Panasonic

THERM PAD 45.3X66X0.35MM GRAY

20

SUPERTHERMAL-D089-02-00-1400-1400

SUPERTHERMAL-D089-02-00-1400-1400

Aavid

PAD SUPER D089 0.2MM 140X140MM

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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