Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A1780-15-15-0.5

TG-A1780-15-15-0.5

t-Global Technology

THERM PAD A1780 15X15X0.5MM

27

SP900S-0.009-AC-62

SP900S-0.009-AC-62

Henkel / Bergquist

THERM PAD 19.05MMX12.7MM W/ADH

0

60-12-4511-T500

60-12-4511-T500

Parker Chomerics

CHO-THERM T500 TO-3 0.010" ADH

474

TG-APC94-320-320-1.0-0

TG-APC94-320-320-1.0-0

t-Global Technology

THERM PAD 320MMX320MM RED

31

OTH-Q81771D-00-DN5

OTH-Q81771D-00-DN5

Laird - Performance Materials

THERM PAD 8MMX8MM GRAY

15000

DC0001/01-TG-A486G-0.3-2A

DC0001/01-TG-A486G-0.3-2A

t-Global Technology

THERM PAD 39.7MMX26.67MM W/ADH

75

TG-A486G-320-320-0.5-0

TG-A486G-320-320-0.5-0

t-Global Technology

THERM PAD 320MMX320MM GRAY

39

N800AH-320-320-1.0

N800AH-320-320-1.0

THERMAL PAD, SHEET 320X320MM, TH

1

A15959-20

A15959-20

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

74

TG-A373L-320-320-2.0-1A

TG-A373L-320-320-2.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH YLW

0

TG-A4500F-160-160-2.5

TG-A4500F-160-160-2.5

t-Global Technology

THERMAL PAD 160X160MM PURPLE

6

AT900P-160-150-0.14

AT900P-160-150-0.14

THERMAL TAPE 160X150MM, THICKNES

4

TG-APC93-19.5-12.7-5.0-0

TG-APC93-19.5-12.7-5.0-0

t-Global Technology

THERM PAD 19.5MMX12.7MM GRAY

168

EYG-S091203DP

EYG-S091203DP

Panasonic

THERM PAD 115MMX90MM GRAY

27

TG-A4500-30-30-1.0

TG-A4500-30-30-1.0

t-Global Technology

THERM PAD A4500 30X30X1MM

10

CD-02-05-190

CD-02-05-190

Wakefield-Vette

THERM PAD 254MMX196.85MM ORANGE

86

28.7MM-48.26MM-25-8810

28.7MM-48.26MM-25-8810

3M

THERM PAD 48.26MMX28.7MM 1=25/PK

0

TG-A1450-40-40-2.0

TG-A1450-40-40-2.0

t-Global Technology

THERM PAD A1450 40X40X2MM

1

TG-A2200-15-15-1.0

TG-A2200-15-15-1.0

t-Global Technology

THERM PAD A2200 15X15X1MM

148

TG-A3500-15-15-4.0

TG-A3500-15-15-4.0

t-Global Technology

THERM PAD A3500 15X15X4MM

985

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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