Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A1250-5-5-1.0

TG-A1250-5-5-1.0

t-Global Technology

THERM PAD A1250 5X5X1MM

5052

BS89-320-320-2.5

BS89-320-320-2.5

THERMAL PAD, SHEET 320X320MM, TH

6

EYG-A121801KV

EYG-A121801KV

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-S0713ZLAG

EYG-S0713ZLAG

Panasonic

THERM PAD 126MMX66MM GRAY

4

Q3-0.005-00-48

Q3-0.005-00-48

Henkel / Bergquist

THERM PAD 25.4MMX25.4MM BLACK

3880

AF500-414505

AF500-414505

CUI Devices

THERM PAD 41.25MMX45MM 1 SH=45PC

7

DC0001/06-TG-AH482-2.0-0

DC0001/06-TG-AH482-2.0-0

t-Global Technology

THERM PAD 41.91MMX28.96MM RED

35

TG-A6200-15-15-2.0

TG-A6200-15-15-2.0

t-Global Technology

THERM PAD A6200 15X15X2MM

410

SUPERTHERMAL-A072-20-02-1400-1400

SUPERTHERMAL-A072-20-02-1400-1400

Aavid

PAD SUPER A072 2MM 140X140MM

0

BP800-0.005-00-1212

BP800-0.005-00-1212

Henkel / Bergquist

THERM PAD 304.8MMX304.8MM W/ADH

0

HSP-1

HSP-1

Sensata Technologies – Crydom

THERM PAD 57.15MMX44.45MM WHITE

116

GP2500S20-0.160-02-0816

GP2500S20-0.160-02-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM YELLOW

0

A16367-04

A16367-04

Laird - Performance Materials

THERM PAD 228.6MMX215.9MM PINK

57

TG997-288-192-2.0

TG997-288-192-2.0

t-Global Technology

THERM PAD 288MMX192MM BLUE

0

A15427-004

A15427-004

Laird - Performance Materials

THERM PAD 19.05MMX12.7MM WHITE

4618

TG-A6200-40-40-3.0

TG-A6200-40-40-3.0

t-Global Technology

THERM PAD A6200 40X40X3MM

18

TG-A20KX-190-140-0.5

TG-A20KX-190-140-0.5

t-Global Technology

THERMAL PAD 190X140MM DARK GREY

7

EYG-T7070A10A

EYG-T7070A10A

Panasonic

THERM PAD 70MMX70MM W/ADH BLACK

1285

173-9-1212P

173-9-1212P

Wakefield-Vette

THERM PAD 304.8MMX304.8MM GRAY

0

40001050

40001050

Würth Elektronik Midcom

WE-TGF THERMAL GAP FILLER PAD

3

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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