| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
|
3M |
THERM PAD 57.25MMX18MM 1=25/PK |
0 |
|
|
|
t-Global Technology |
THERM PAD 33.9MMX33.9MM YELLOW |
0 |
|
|
|
t-Global Technology |
THERM PAD A2200 20X20X1MM |
1402 |
|
|
|
t-Global Technology |
THERM PAD 30MMX11MM GRAY |
0 |
|
|
|
Aavid |
PAD SOFTFLEX B016 1MM 400X200MM |
0 |
|
|
|
Wakefield-Vette |
THERM PAD 25.4MMX25.4MM ORANGE |
54 |
|
|
|
Taica Corporation |
THERMAL INTERFACE PAD, GAP PAD, |
36 |
|
|
|
t-Global Technology |
THERM PAD 400MMX300MM GRAY |
3 |
|
|
|
t-Global Technology |
THERM PAD A6200 15X15X1.5MM |
739 |
|
|
|
Taica Corporation |
THERMAL INTERFACE PAD, GAP PAD, |
10 |
|
|
|
SUPERTHERMAL-D089-02-00-0762-0762 Aavid |
PAD SUPERTHERMAL 0.2MM D089 3X3" |
0 |
|
|
|
t-Global Technology |
THERM PAD A1660 25X25X1MM |
53 |
|
|
THERMAL PAD, SHEET 160X160MM, TH |
3 |
|
||
|
Henkel / Bergquist |
THERM PAD 406.4MMX203.2MM YELLOW |
2 |
|
|
|
Parker Chomerics |
THERM-A-GAP G579 9X9X0.080" |
43 |
|
|
|
t-Global Technology |
THERM PAD 41.91MMX28.96MM W/ADH |
0 |
|
|
|
Laird - Performance Materials |
THERM PAD 25.4MMX19.05MM WHITE |
1610 |
|
|
|
t-Global Technology |
THERM PAD 100MMX100MM WHITE |
0 |
|
|
|
t-Global Technology |
THERM PAD 320MMX320MM RED |
8 |
|
|
|
t-Global Technology |
THERMAL PAD 320X320MM PURPLE |
35 |
|
Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.
| Type | Functional Features | Application Examples |
|---|---|---|
| Silicone-Based Pads | High flexibility, low compression force, dielectric insulation | Smartphones, laptops, LED lighting |
| Non-Silicone Pads | Lower cost, reduced silicone oil migration | Power supplies, industrial controls |
| Phase Change Materials (PCM) | Softening at operational temperatures for better contact | CPUs, GPUs, servers |
| Metal-Backed Pads | Aluminum/copper reinforcement for structural support | EV battery packs, high-power lasers |
| Graphite Sheets | Ultra-thin, anisotropic heat spreading | 5G base stations, wearable devices |
Typical thermal pads consist of:
| Parameter | Importance |
|---|---|
| Thermal Conductivity (W/m K) | Measures heat transfer efficiency (ASTM D5470) |
| Thickness (mm) | Impacts contact resistance and compression force |
| Operating Temperature Range ( C) | Determines material stability under thermal stress |
| Hardness (Shore 00) | Affects conformability to surfaces |
| Adhesion Strength (N/mm ) | Critical for mechanical fixation |
| Electrical Insulation (kV/mm) | Essential for high-voltage applications |
Major industries include:
| Manufacturer | Representative Product | Key Specification |
|---|---|---|
| Laird Performance Materials | THERM-A-GAP GEL 15 | 15 W/m K, 0.5mm thickness |
| Bergquist (Henkel) | Gap Pad 1500S | Silicone-free, 8.0 W/m K |
| 3M | 5595 PCM | Phase change at 55 C, 12 W/m K |
| Fujipoly | SARCON Matrix MG | Metal-gel hybrid, 20 W/m K |
| Momentive | TSE 3045 | Graphite sheet, 400 W/m K (in-plane) |
Key considerations:
Emerging trends include: