Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
21MM-21MM-25-8810

21MM-21MM-25-8810

3M

THERM PAD 21MMX21MM W/ADH 1=25PK

0

TG-AH482-640-320-5.0-0

TG-AH482-640-320-5.0-0

t-Global Technology

THERM PAD 640MMX320MM RED

2

LI2000-320-320-0.15

LI2000-320-320-0.15

t-Global Technology

THERM PAD 320MMX320MM W/ADH WHT

2

TG-A20KF-385-285-5.0

TG-A20KF-385-285-5.0

t-Global Technology

THERMAL PAD 385X285MM DARK GREY

10

TG-A1780-30-30-0.5

TG-A1780-30-30-0.5

t-Global Technology

THERM PAD A1780 30X30X0.5MM

291

TG-AL373-100-100-0.5-0

TG-AL373-100-100-0.5-0

t-Global Technology

THERM PAD 100MMX100MM YELLOW

0

3/4-5-8810

3/4-5-8810

3M

THERM TAPE 4.57MX19.05MM W/ADH

258

5590H-05-2

5590H-05-2"-CIRCLE-100/PK

3M

THERM PAD 50.8MM DIA GRAY

232

PC98-288-192-1.0

PC98-288-192-1.0

t-Global Technology

THERM PAD 288MMX192MM WHITE

34

BS87-320-320-1.5

BS87-320-320-1.5

THERMAL PAD, SHEET 320X320MM, TH

6

5583S 210 MM X 300 MM X 2.5MM

5583S 210 MM X 300 MM X 2.5MM

3M

THERM PAD 300MMX210MM WHITE

0

TG-A4500-40-40-0.5

TG-A4500-40-40-0.5

t-Global Technology

THERM PAD A4500 40X40X0.5MM

40

DC0011/07-TI900-0.12-0

DC0011/07-TI900-0.12-0

t-Global Technology

THERM PAD 19.05MMX10.41MM WHITE

26

GPVOUS-0.020-01-0816

GPVOUS-0.020-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM PINK

69

TG-A373S-320-320-10.0-1A

TG-A373S-320-320-10.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH YLW

0

EYG-R0715ZRSD

EYG-R0715ZRSD

Panasonic

THERM PAD 67X153X0.35MM GRAY

10

CD-02-05-DO4

CD-02-05-DO4

Wakefield-Vette

THERM PAD DO-4 0.625OD/0.203"ID

500

TG-A126X-100-100-0.5

TG-A126X-100-100-0.5

t-Global Technology

THERM PAD 100MMX100MM GRAY

0

TG-A1250-20-20-1.0

TG-A1250-20-20-1.0

t-Global Technology

THERM PAD A1250 20X20X1MM

106

BP100-0.005-00-1112

BP100-0.005-00-1112

Henkel / Bergquist

THERM PAD 304.8MMX279.4MM W/ADH

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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