Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A3500-5-5-1.5

TG-A3500-5-5-1.5

t-Global Technology

THERM PAD A3500 5X5X1.5MM

900

SP400-0.007-00-104

SP400-0.007-00-104

Henkel / Bergquist

THERM PAD 25.4MMX19.05MM GRAY

1461

TG-A373F-320-320-0.3-1A

TG-A373F-320-320-0.3-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH YLW

453

PR27-320-300-0.127

PR27-320-300-0.127

THERMAL PAD, SHEET 320X300MM, TH

1

LI98CN-50M-320-0.18

LI98CN-50M-320-0.18

t-Global Technology

THERM PAD 50MX320MM W/ADH WHITE

0

T62-1-24-24-0.16

T62-1-24-24-0.16

t-Global Technology

THERM PAD 24MMX24MM W/ADH BLACK

0

TG-A373S-100-100-10.0-0

TG-A373S-100-100-10.0-0

t-Global Technology

THERM PAD 100MMX100MM YELLOW

0

TG-A486A-320-320-5.0-1A

TG-A486A-320-320-5.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH

0

EYG-S0607ZLGL

EYG-S0607ZLGL

Panasonic

THERM PAD 69.7MMX58MM GRAY

27

DC0011/10-TI900-0.12-2A

DC0011/10-TI900-0.12-2A

t-Global Technology

THERM PAD 19.05MMX12.7MM W/ADH

0

DC0019/03-TG-A482K-0.1-0

DC0019/03-TG-A482K-0.1-0

t-Global Technology

THERM PAD 31.75MM X 31.75MM RED

2

N800AH-320-320-5.0

N800AH-320-320-5.0

THERMAL PAD, SHEET 320X320MM, TH

1

A17747-03

A17747-03

Laird - Performance Materials

TFLEX P330 9.00X9.00IN

5

EYG-A091207RV

EYG-A091207RV

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

TG4040SA-288-192-1.5

TG4040SA-288-192-1.5

t-Global Technology

THERM PAD 288MMX192MM WHITE

15

AF100-151505

AF100-151505

CUI Devices

THERM PAD 15MMX15MM 1 SHT=325PC

8

EYG-A121802DM

EYG-A121802DM

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

291

TW-T150-01-10

TW-T150-01-10

3G Shielding Specialties

THERMAL INTERFACE MATERIAL

19

PK504-160-160-3.5

PK504-160-160-3.5

THERMAL PAD, SHEET 160X160MM, TH

4

A15371-02

A15371-02

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

10

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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