Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
PRT-17054

PRT-17054

SparkFun

THERMAL TAPE 4X4" SQUARE

145

A15433-003

A15433-003

Laird - Performance Materials

THERM PAD 24MMX21.01MM TAN

0

TG-A373S-150-150-3.0-0

TG-A373S-150-150-3.0-0

t-Global Technology

THERM PAD 150MMX150MM YELLOW

17

EYG-S060910

EYG-S060910

Panasonic

THERM PAD 90MMX60MM GRAY

0

60-11-8302-1671

60-11-8302-1671

Parker Chomerics

CHO-THERM 1671 TO-220

295

A17916-04

A17916-04

Laird - Performance Materials

TFLEX B240 9X9IN

13

53-77-4G

53-77-4G

Aavid

THERM PAD 19.05X12.7MM GRY/GRN

9093

TG-AL373-300-300-5.0-0

TG-AL373-300-300-5.0-0

t-Global Technology

THERM PAD 300MMX300MM YELLOW

0

TG-A4500-325-325-1.0

TG-A4500-325-325-1.0

t-Global Technology

SILICONE THERMAL PAD 325X325X1.0

0

A14704-22

A14704-22

Laird - Performance Materials

THERM PAD 457.2MMX279.4MM W/ADH

42

GT15-320-320-0.23-0

GT15-320-320-0.23-0

t-Global Technology

THERM PAD 320MMX320MM YELLOW

0

8805-14

8805-14"X36YD

3M

THERM PAD 32.92MX355.6MM W/ADH

1

EYG-S1315ZLGA

EYG-S1315ZLGA

Panasonic

THERM PAD 150MMX129.5MM GRAY

1

A17752-08

A17752-08

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

74

TG-A2200-15-15-2.0

TG-A2200-15-15-2.0

t-Global Technology

THERM PAD A2200 15X15X2MM

532

PK504-320-320-0.5

PK504-320-320-0.5

THERMAL PAD, SHEET 320X320MM, TH

1

TG-A4500-5-5-0.5

TG-A4500-5-5-0.5

t-Global Technology

THERM PAD A4500 5X5X0.5MM

0

TG-A4500-20-20-2.0

TG-A4500-20-20-2.0

t-Global Technology

THERM PAD A4500 20X20X2MM

339

EYG-S091205

EYG-S091205

Panasonic

THERM PAD 115MMX90MM GRAY

5

60-11-4659-T500

60-11-4659-T500

Parker Chomerics

CHO-THERM T500 DO-4 0.010"

500

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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