Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
TG-A6200-107-53-3.0

TG-A6200-107-53-3.0

t-Global Technology

THERMAL PAD 107X53MM BLUE

0

60-11-4997-T441-08

60-11-4997-T441-08

Parker Chomerics

CHO-THERM T441 TO-66 0.008"

457

TG-APC93-20-20-3.0-0

TG-APC93-20-20-3.0-0

t-Global Technology

THERM PAD 20MMX20MM GRAY

66

TG-AL375-640-320-2.0-1A

TG-AL375-640-320-2.0-1A

t-Global Technology

THERM PAD 640MMX320MM W/ADH GRAY

1

A12622-01

A12622-01

Laird - Performance Materials

THERM PAD 228.6X228.6MM BLU/VIO

143

TG-A6200-5-5-1.5

TG-A6200-5-5-1.5

t-Global Technology

THERM PAD A6200 5X5X1.5MM

470

TG-A6200-100-100-4.0

TG-A6200-100-100-4.0

t-Global Technology

SILICONE THERMAL PAD 100X100X4.0

39

EYG-R0917ZRWC

EYG-R0917ZRWC

Panasonic

THERM PAD 85X168X0.35MM GRAY

10

TG-A6200-10-10-5.0

TG-A6200-10-10-5.0

t-Global Technology

THERM PAD A6200 10X10X5MM

61

TG-A3500-20-20-1.0

TG-A3500-20-20-1.0

t-Global Technology

THERM PAD A3500 20X20X1MM

55

A15973-08

A15973-08

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GREEN

19

69-12-42353-T441

69-12-42353-T441

Parker Chomerics

CHO-THERM T441 8X8" 0.008"

25

TG-AH486-640-320-1.0-0

TG-AH486-640-320-1.0-0

t-Global Technology

THERM PAD 640MMX320MM GRAY

5

EYG-R0811ZRWG

EYG-R0811ZRWG

Panasonic

THERM PAD 78X108X0.35MM GRAY

10

DTT65-320-320-1.0

DTT65-320-320-1.0

THERMAL PAD, SHEET 320X320MM, TH

6

60-12-4661-1674

60-12-4661-1674

Parker Chomerics

CHO-THERM 1674 DO-5 0.010" ADH

468

5584 210 MM X 300 MM X 1.0 MM

5584 210 MM X 300 MM X 1.0 MM

3M

THERM PAD 300MMX210MM WHITE

50

GPTGP7000ULM-0.060-02-0808

GPTGP7000ULM-0.060-02-0808

Henkel / Bergquist

GAP PAD 8X8" SHEET 0.060"

0

SOFTFLEX-E038-30-02-0762-0762

SOFTFLEX-E038-30-02-0762-0762

Aavid

PAD SOFTFLEX E038 3MM 3X3"

0

EYG-A091204RV

EYG-A091204RV

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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