Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
V833-150-150-0.2

V833-150-150-0.2

t-Global Technology

PHASE CHANGE MATERIAL 150X150X0.

30

A15959-16

A15959-16

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

8

60-11-D397-1674

60-11-D397-1674

Parker Chomerics

CHO-THERM 1674 TO-220 0.010"

1284

EYG-A091205PA

EYG-A091205PA

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

9

GCS-030-2.0

GCS-030-2.0

THERMAL PAD, 4W/M K, 2.0MM

0

TG-A38KX-190-140-3.0

TG-A38KX-190-140-3.0

t-Global Technology

THERMAL PAD 190X140MM BLUE

10

TG-AL373-640-320-0.5-0

TG-AL373-640-320-0.5-0

t-Global Technology

THERM PAD 640MMX320MM YELLOW

4

HSP-2

HSP-2

Sensata Technologies – Crydom

THERM PAD 57.15MMX44.45MM W/ADH

0

GPEMI1.0-0.100-01-0816

GPEMI1.0-0.100-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BLACK

0

TG-A4500F-320-320-1.5

TG-A4500F-320-320-1.5

t-Global Technology

THERMAL PAD 320X320MM PURPLE

11

A15440-112

A15440-112

Laird - Performance Materials

THERM PAD 31.75MMX31.75MM GRAY

2334

N800A-160-160-3.5

N800A-160-160-3.5

THERMAL PAD, SHEET 160X160MM, TH

4

DC0011/06-TG-A482K-0.1-0

DC0011/06-TG-A482K-0.1-0

t-Global Technology

THERM PAD 18.03MM X 12.70MM RED

0

TG-A1780-25-25-2.0

TG-A1780-25-25-2.0

t-Global Technology

THERM PAD A1780 25X25X2MM

11

53-77-4ACG

53-77-4ACG

Aavid

THERM PAD 19.05X12.7MM W/ADH

6679

4177G

4177G

Aavid

THERM PAD 17.45MMX14.27MM

3189

A15750-00

A15750-00

Laird - Performance Materials

THERM PAD 457.2MMX279.4MM W/ADH

0

A15440-003

A15440-003

Laird - Performance Materials

THERM PAD 31.75MMX31.75MM TAN

0

AF500-313005

AF500-313005

CUI Devices

THERM PAD 30MMX31.25MM 1SH=78PC

4

EYG-R0508ZLMJ

EYG-R0508ZLMJ

Panasonic

THERM PAD 46.2X83X0.25MM GRAY

30

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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