Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
EYG-A121801PA

EYG-A121801PA

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

1

60-11-4511-T441-08

60-11-4511-T441-08

Parker Chomerics

CHO-THERM T441 TO-3 0.008"

380

EYG-R0508ZRMJ

EYG-R0508ZRMJ

Panasonic

THERM PAD 46.2X83X0.35MM GRAY

20

PK404-160-160-5.0

PK404-160-160-5.0

THERMAL PAD, SHEET 160X160MM, TH

4

TG-AH486-25-25-9.0-0

TG-AH486-25-25-9.0-0

t-Global Technology

THERM PAD 25MMX25MM GRAY

938

2-5-8805

2-5-8805

3M

THERM PAD 4.57MX50.8MM WHT

59

TG-AH486-45-25-6.0-0

TG-AH486-45-25-6.0-0

t-Global Technology

THERM PAD 45MMX25MM GRAY

187

A15896-04

A15896-04

Laird - Performance Materials

THERM PAD 228.6MMX228.6MM GRAY

88

TG-AH482-150-150-3.0-1A

TG-AH482-150-150-3.0-1A

t-Global Technology

THERM PAD 150MMX150MM W/ADH RED

11

EYG-A091205KV

EYG-A091205KV

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

N700B-320-320-1.5

N700B-320-320-1.5

THERMAL PAD, SHEET 320X320MM, TH

1

TG-AL373-640-320-2.0-0

TG-AL373-640-320-2.0-0

t-Global Technology

THERM PAD 640MMX320MM YELLOW

3

CD-02-05-C-20

CD-02-05-C-20

Wakefield-Vette

THERM PAD 0.768" X 0.768"

430

TG-A4500-20-20-5.0

TG-A4500-20-20-5.0

t-Global Technology

THERM PAD A4500 20X20X5MM

6

TG-A486A-320-320-3.0-1A

TG-A486A-320-320-3.0-1A

t-Global Technology

THERM PAD 320MMX320MM W/ADH

22

V833-150-150-0.13

V833-150-150-0.13

t-Global Technology

PHASE CHANGE MATERIAL 150X150X0.

41

SF500G-505005

SF500G-505005

CUI Devices

THERMAL INTERFACE MATERIAL, SF50

0

TG-A6200-160-160-0.8

TG-A6200-160-160-0.8

t-Global Technology

THERMAL PAD 160X160MM BLUE

0

EYG-R0204ZRSN

EYG-R0204ZRSN

Panasonic

THERM PAD 24X36.5X0.35MM GRAY

30

TP-GP01-B

TP-GP01-B

THERMAL PAD 80X40X1.0MM 12 WATT

47

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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