| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 63W 8.1X3X70MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 27W 9.5X6.5X250MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
ROUND HEATPIPE 35W 9.5X500MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 18W 10.9X3.8X350MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 30W 11.1X3.2X200MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 30W 7.8X3.5X150MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 11W 8.1X3X400MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 14W 10.4X4.5X450MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 30W 11.3X3X200MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 21W 8.4X2.3X200MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 20W 6.8X5.3X250MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 18W 10.4X4.5X350MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 35W 6.7X2.5X100MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 14W 7.1X4.8X350MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 11W 5.9X4X350MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
ROUND HEATPIPE 37W 7X350MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 23W 7.8X3.5X200MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 23W 9.5X6.5X300MM |
0 |
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 31W 10.4X4.5X200MM |
0 |
|
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Advanced Thermal Solutions, Inc. |
FLAT HEATPIPE 41W 4.8X3X70MM |
146 |
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Heat pipes and vapor chambers are passive two-phase heat transfer devices that utilize phase change cycles (evaporation-condensation) to efficiently redistribute thermal energy. These technologies play critical roles in modern electronics, aerospace, and energy systems by maintaining optimal operating temperatures for high-performance components.
| Type | Functional Features | Application Examples |
|---|---|---|
| Sintered Wick Heat Pipe | High thermal conductivity (5-10x copper), anti-gravity operation | CPU/GPU cooling in servers |
| Gravity-Assisted Heat Pipe | Lower cost, requires vertical orientation | Air-cooled heat sinks for consumer electronics |
| Variable Conductance Heat Pipe (VCHP) | Temperature-controlled operation via non-condensable gas | Aerospace thermal regulation systems |
| Copper-Water Vapor Chamber | Ultra-thin design ( 3mm), planar heat spreading | Smartphone SoC cooling |
| Stainless Steel-Amonia VC | High reliability for extreme environments | Satellite thermal control |
Heat pipes typically consist of: 1) Inner wick structure (sintered powder, grooved, or mesh), 2) Working fluid (water, ammonia, or methanol), 3) Sealed container (copper, aluminum). Vapor chambers have similar components but feature: 1) Flat sealed enclosure with internal support pillars, 2) Multi-directional vapor flow channels, 3) Advanced micro-structured wick layers.
| Parameter | Importance | Typical Values |
|---|---|---|
| Effective Thermal Conductivity | Determines heat transport capacity | 10,000-50,000 W/m K |
| Operating Temperature Range | Defines environmental compatibility | -50 C to 300 C |
| Maximum Heat Transport Capacity | Design limit for thermal load | 50-500 W |
| Pressure Resistance | Structural integrity under stress | 1-5 MPa |
| Response Time | Speed of thermal equilibrium | 10-100 ms |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Cooler Master | Hyper Heat Pipe Series | Nano-fiber wick structure, 120W capacity |
| Thermacore | TS Heat Pipe | Space-qualified VCHP design |
| Aavid (TE Connectivity) | Vapor Chamber 3.0 | 0.8mm thickness for mobile devices |
| Calsonic Kansei | AeroChamber VC | For automotive LiDAR systems |
Key considerations include: 1) Thermal load requirements, 2) Available space constraints, 3) Operating environment conditions (temperature/vibration), 4) Interface compatibility (Cp vs. Al), 5) Cost-performance trade-offs. For high-reliability applications, materials selection and accelerated life testing become critical factors.
The market is evolving towards micro-scale integration (e.g., 0.4mm diameter heat pipes), advanced nanofluid working media, and hybrid systems combining heat pipes with liquid cooling. Emerging applications in 5G infrastructure and autonomous vehicle systems are driving demand for ultra-thin vapor chambers with 3D printing-formed wick structures. Market growth is projected at 12.8% CAGR through 2030, with significant R&D investments in space thermal control and data center liquid-assisted solutions.