Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
20-101-0357

20-101-0357

Digi

COMPUTER SINGLE-BOARD BL1810

87

20-101-0602

20-101-0602

Digi

COMPUTER SGL-BRD BL2500 44.2MHZ

2

20-101-1258

20-101-1258

Digi

COMPUTER SINGLE-BOARD BL4S160

45

20-101-0463

20-101-0463

Digi

COMPUTER SINGLE-BOARD BL2120

3

CC-SB-WMX-KK8D

CC-SB-WMX-KK8D

Digi

CONNECTCORE 6 PLUS SBC

0

CC-SBE-WMX-JN58

CC-SBE-WMX-JN58

Digi

CONNECTCORE

0

20-101-0492

20-101-0492

Digi

MODULE OP6800 FULL-FEATURED

0

20-101-1260

20-101-1260

Digi

BL5S220 SBC (RCM5400-BASED)

0

101-0697

101-0697

Digi

COMPUTER SNGL BD BL2101 BOTT MNT

0

101-0575

101-0575

Digi

COMPUTER SNGLBD BL2500 256K FLSH

0

20-101-0462

20-101-0462

Digi

COMPUTER SINGLE-BOARD BL2110

0

101-0546

101-0546

Digi

COMPUTER SNGL BD BL2130 BOTT MNT

0

CC-SB-WMX-L87C-1

CC-SB-WMX-L87C-1

Digi

CONNECTCORE 6 SBC, I.MX6DUAL, IN

0

20-101-1255

20-101-1255

Digi

COMPUTER SINGLE-BOARD BL4S100

0

20-101-1261

20-101-1261

Digi

COMPUTER SINGLE-BOARD BL4S230

0

20-101-0358

20-101-0358

Digi

COMPUTER SINGLE-BOARD BL1820

0

CC-SB-WMX-J97C-1

CC-SB-WMX-J97C-1

Digi

CONNECTCORE 6 SBC, I.MX6QUAD, -2

0

CC-SB-WMX-L76C-1

CC-SB-WMX-L76C-1

Digi

CONNECTCORE 6 SBC, I.MX6DUALLITE

0

101-0492

101-0492

Digi

INTERFACE OP6800 W/ETHERNET PORT

0

20-101-0697

20-101-0697

Digi

COMPUTER SNGL BD BL2101 BOTT MNT

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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