Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
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20-101-0599

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COMPUTER SGL-BD BL2500 FLSH/SRAM

0

20-101-0497

20-101-0497

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MODULE OP6810 W/O ETH/MEM EXPANS

22

CC-SB-WMX-L87C

CC-SB-WMX-L87C

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CONNECTCORE WI-I.MX6DUAL

66

CC-SBP-WMX-JN7A

CC-SBP-WMX-JN7A

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CONNECTCORE 6UL SBC PRO 1G-1G-W

17

20-101-0575

20-101-0575

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COMPUTER SGL-BRD BL2500 29.4MHZ

0

20-101-0461

20-101-0461

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COMPUTER SGL-BOARD FULL BL2100

17

20-101-0457

20-101-0457

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COMPUTER SINGLE-BOARD BL2030

0

20-101-0537

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INTERFACE OP7200 W/TCHSCRN&512K

27

20-101-0536

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INTERFACE INTELL OPERATOR OP7210

0

20-101-0456

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COMPUTER SINGLE-BOARD BL2020

0

20-101-1256

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COMPUTER SINGLE-BOARD BL4S110

54

20-101-0538

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INTERFACE OP7210 WITH 512K/512K

0

20-101-0526

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COMPUTER SNGLBD LP3510 FOX7.4MHZ

0

20-101-0525

20-101-0525

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COMPUTER SINGLE-BOARD LP3500 FOX

41

20-101-0891

20-101-0891

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COMPUTER SGL-BRD 29.4MHZ BL2610

11

20-101-1220

20-101-1220

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COMPUTER SINGLE-BOARD BL4S200

334

20-101-0535

20-101-0535

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INTERFACE INTELL OPERATOR OP7200

9

20-101-0430

20-101-0430

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COMPUTER SGL-BOARD FULL BL2000

30

20-101-1095

20-101-1095

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BL2600 XD 16MB NAND 10/100

1

20-101-1259

20-101-1259

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COMPUTER SINGLE-BOARD BL4S210

46

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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