Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
3288H4549-1

3288H4549-1

QUAD 48 2.0 CMOS6SF 5MT

0

ITA-3630-01A1E

ITA-3630-01A1E

Advantech

ITA-3630 W/I5-3610ME+HM76 W/CF B

0

ITA-1710-S0A1E

ITA-1710-S0A1E

Advantech

COMPUTER SYSTEM ITA-1710 ATOM D

0

P5010NSE1TNB557

P5010NSE1TNB557

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 64 BIT POWER ARCH SOC, 1.

0

ASMB-585G4-00A1E

ASMB-585G4-00A1E

Advantech

LGA 1151 INTEL XEON E3 V5/6TH

0

VL-EPU-4562-EBP-04

VL-EPU-4562-EBP-04

VersaLogic Corporation

EPU BLACKBIRD CORE I5, 2-CORE, E

0

AIMB-231G2Z-U3A1E

AIMB-231G2Z-U3A1E

Advantech

AIMB-231G2Z-U3A1E

0

ARK-5420-U5A1E

ARK-5420-U5A1E

Advantech

COMPUTER SYSTEM ARK-5420

0

DFR0354

DFR0354

DFRobot

MIXTILE LOFT-Q (A31 QUAD-CORE PR

0

C-BUNDLE-ARK1122-4

C-BUNDLE-ARK1122-4

Advantech

ARK-1122H-S6A1E + 15" PANEL MNT

0

AIMB-242QG2-H5A1E

AIMB-242QG2-H5A1E

Advantech

MITX W/I5-6440EQ+QM170, 2DP/HDMI

0

3229P2294-1

3229P2294-1

SUPERMAN CMOS6SF 5MT 32X42CCGA

0

ITA-5831-L7A1E

ITA-5831-L7A1E

Advantech

ITA-5831,I7-6822EQ+8G MEMORY,DC-

0

EDM1IMX6PUR10E04TE

EDM1IMX6PUR10E04TE

TechNexion

MODULE EDM COMPACT TYPE 1

0

PICOIMX6G205R512E04BW

PICOIMX6G205R512E04BW

TechNexion

PICO SOM NXP I.MX6 ULTRALITE 528

0

PICOIMX6G205R512Q128BWTE

PICOIMX6G205R512Q128BWTE

TechNexion

PICO SOM NXP I.MX6 ULTRALITE 528

0

AIIS-3400U-00A1E

AIIS-3400U-00A1E

Advantech

USB3.0 CONTROL VISION SYSTEM,H11

0

P5020NSE7MMB557

P5020NSE7MMB557

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 64 BIT POWER ARCH SOC, DU

0

AGS-920I-R14A1E

AGS-920I-R14A1E

Advantech

2U GPU SERVER SUPPORT UP TO 4*DO

0

C-BUNDLE-ARK1122-1

C-BUNDLE-ARK1122-1

Advantech

ARK-1122H-S6A1E+ 10.4" OPEN FRAM

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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