| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Advantech |
FANLESS PC ATOM D525 DUAL 1.8GHZ |
0 |
|
|
Seeed |
ROCK960 BOARD BASED ON THE RK339 |
0 |
|
|
Advantech |
INTEL ATOM N450 COM EXPRESS COMP |
0 |
|
|
Advantech |
INTEL I3-6100U W/ HD520 SIGNAGE |
0 |
|
|
TechNexion |
MODULE EDM COMPACT TYPE 1 |
0 |
|
|
Advantech |
32" UTC WITH HASWELL I5-4300U/ 4 |
0 |
|
|
Advantech |
AMD T16R PC/104 SBC VGA LVDS |
0 |
|
|
Advantech |
ATOM E3826(DC1.75G) UTX MB.2GBE |
0 |
|
|
TechNexion |
PICO SOM NXP I.MX6 ULTRALITE 528 |
0 |
|
|
TechNexion |
PICO SOM NXP I.MX6 ULTRALITE 528 |
0 |
|
|
TechNexion |
PICO SOM NXP I.MX6 DUALLITE 1GHZ |
0 |
|
|
Advantech |
ATOM N2600 1.6GHZ W/PHOENIX GOLD |
0 |
|
|
Advantech |
INTEL I5-6300U W/HD520 SIGNAGE B |
0 |
|
|
TechNexion |
TEK3 FANLESS BOX PC NXP I.MX6 QU |
0 |
|
|
Advantech |
ARK-DS262 OPS INTEL CELERON J1 |
0 |
|
|
Advantech |
INTEL QM67 COM EXPRESS I7-2610UE |
0 |
|
|
Advantech |
QUALCOMM APQ8016 QUAD CORE 1.2GH |
0 |
|
|
Advantech |
I3-5010U 2.1GHZ 15W 2C -40 85C |
0 |
|
|
Freescale Semiconductor, Inc. (NXP Semiconductors) |
QORIQ, 64 BIT POWER ARCH SOC, 1. |
0 |
|
|
Advantech |
PC/104 2-SLOT PCMCIA MODULE |
0 |
|
Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| SBC (e.g., Raspberry Pi) | Complete system with CPU, RAM, storage, and I/O interfaces | Smart home devices, educational tools |
| COM (e.g., COM Express) | Modular design with processor, memory, and basic I/O; requires carrier board | Medical imaging systems, industrial controllers |
| Industrial SBC | Ruggedized components for harsh environments | Factory automation, outdoor kiosks |
A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.
| Parameter | Description | Importance |
|---|---|---|
| CPU Performance | Measured in DMIPS or GHz | Determines processing capability |
| Thermal Design Power (TDP) | Power consumption in watts | Impacts cooling requirements |
| Interface Types | USB 3.0, PCIe, CAN, etc. | Dictates peripheral compatibility |
| Operating Temperature | -40 C to +85 C range | Defines environmental tolerance |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Raspberry Pi Foundation | Raspberry Pi 4 Model B | Quad-core Cortex-A72, 4K HDMI |
| Intel | COM Express modules | 11th Gen Core processors, PCIe 4.0 |
| NVIDIA | JETSON AGX Xavier | AI accelerator, 32 TOPS performance |
| Advantech | AIMB-236 SBC | Intel Atom x6425E, -20 C to 70 C operation |
Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.
Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.