Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
VS-GA200SA60UP Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 200A 500W SOT227	0
FS100R12KT4GB11BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 100A 515W	0
F3L75R12W1H3B27BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 45A 275W	22
6MS30017E43W40372NOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 1800A	0
FF450R12KT4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 580A 2400W	26
FP06R12W1T4B3BOMA1 IR (Infineon Technologies)	FP06R12 - IGBT MODULE	24
CM300EXS-24S Powerex, Inc.	IGBT MOD 1200V 300A 2270W	3
APT47GA60JD40 Roving Networks / Microchip Technology	IGBT 600V 87A 283W SOT-227	0
DF400R12KE3HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 580A 2000W	0
MG12600WB-BR2MM Wickmann / Littelfuse	IGBT MODULE 1200V 750A 2500W WB	0
F3L200R12W2H3B11BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 100A 600W	6
DDB6U180N16RRB11BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 140A 515W	0
FS300R12OE4PNOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 600A 20MW	0
FS100R07PE4BOSA1 IR (Infineon Technologies)	FS100R07 - IGBT MODULE	157
FD400R12KE3B5HOSA1 IR (Infineon Technologies)	FD400R12 - IGBT MODULE	330
FZ600R12KE3HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 900A 2800W	37
FF200R12MT4 IR (Infineon Technologies)	IGBT MODULE	6
APTGT200DA60T3AG Roving Networks / Microchip Technology	IGBT MODULE 600V 290A 750W SP3	0
FS100R12W2T7B11BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 100A 20MW EASY	20
APT200GT60JR Roving Networks / Microchip Technology	IGBT MOD 600V 195A 500W SOT227	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability