Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
FZ400R65KE3NOSA1 IR (Infineon Technologies)	IGBT MOD 6500V 800A 8350W	0
FP75R12KE3BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 105A 355W	19
A2C50S65M2-F STMicroelectronics	IGBT MOD 650V 50A 208W ACEPACK2	0
FF1000R17IE4PBOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 1000A	0
APTGT100H60T3G Roving Networks / Microchip Technology	IGBT MODULE 600V 150A 340W SP3	14
FS225R17KE4BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 340A 1500W	0
FZ1200R17HE4HOSA2 IR (Infineon Technologies)	FZ1200R17 - IGBT MODULE	12
FF400R17KE4HOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 400A	25
VS-GT100DA120UF Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 187A 890W SOT227	129
FF1500R17IP5BPSA1 IR (Infineon Technologies)	IGBT MOD 1700V 1500A 20MW	2
FZ1500R33HE3BPSA1 IR (Infineon Technologies)	IGBT MODULE 3300V 1500A	2
F1235R12KT4GBOSA1 IR (Infineon Technologies)	IGBT, 1200V, N-CHANNEL	90
FF225R17ME3BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 340A 1400W	0
FZ1800R12HE4B9HOSA2 IR (Infineon Technologies)	IGBT MODULE 1200V 2735A	0
FZ400R12KE4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 400A 2400W	100
FF300R12KE4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 460A 1600W	37
FF400R17KE4EHOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 400A	10
FF600R12IP4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 600A 3350W	11
APT200GN60J Roving Networks / Microchip Technology	IGBT MOD 600V 283A 682W ISOTOP	123
FZ300R12KE3GHOSA1 IR (Infineon Technologies)	FZ300R12 - IGBT MODULE	20

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability