Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
APTGT200A60T3AG Roving Networks / Microchip Technology	IGBT MODULE 600V 290A 750W SP3	0
FF300R17ME4BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 375A 1800W	10
APTGL475U120D4G Roving Networks / Microchip Technology	IGBT MODULE 1200V 610A 2082W D4	20
APT60GA60JD60 Roving Networks / Microchip Technology	IGBT MOD 600V 112A 356W ISOTOP	464
FZ1000R33HE3BPSA1 IR (Infineon Technologies)	IGBT MODULE 3300V 1000A	2
FS75R12KT4B11BOSA1 IR (Infineon Technologies)	FS75R12 - IGBT MODULE	20
APTGT600U170D4G Roving Networks / Microchip Technology	IGBT MODULE 1700V 1100A 2900W D4	52
DD800S45KL3B5NPSA1 IR (Infineon Technologies)	IGBT MOD 4500V 800A 1600W	0
APTGT200TL60G Roving Networks / Microchip Technology	IGBT MODULE 600V 300A 652W SP6	2
FF23MR12W1M1PB11BPSA1 IR (Infineon Technologies)	LOW POWER EASY	0
FD900R12IP4DVBOSA1 IR (Infineon Technologies)	FD900R12 - INSULATED GATE BIPOLA	3
FF450R12ME4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 675A 2250W	1
DF1000R17IE4PBPSA1 IR (Infineon Technologies)	PP IHM I XHP 1 7KV	0
FP100R07N3E4B11BOSA1 IR (Infineon Technologies)	IGBT MOD 650V 100A 335W	0
FZ3600R17HP4HOSA2 IR (Infineon Technologies)	IGBT MODULE 1700V 3600A	0
FF150R12ME3GBOSA1 IR (Infineon Technologies)	IGBT MODULE	220
APT60GF120JRDQ3 Roving Networks / Microchip Technology	IGBT MOD 1200V 149A 625W ISOTOP	10
FS100R17KE3BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 145A 555W	0
FS400R07A1E3S7BOMA1 IR (Infineon Technologies)	IGBT MODULE	0
IXYN100N65C3H1 Wickmann / Littelfuse	IGBT MOD 650V 166A 600W SOT227B	1397

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability