Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
APT75GT120JU3 Roving Networks / Microchip Technology	IGBT MOD 1200V 100A 416W SOT227	0
MG12400D-BN2MM Wickmann / Littelfuse	IGBT MODULE 1200V 580A 1925W D3	0
FS75R12W2T7B11BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 75A	23
IXYN80N90C3H1 Wickmann / Littelfuse	IGBT MOD 900V 115A 500W SOT227B	160
APTGT600SK60G Roving Networks / Microchip Technology	IGBT MODULE 600V 700A 2300W SP6	0
NXH35C120L2C2SG Sanyo Semiconductor/ON Semiconductor	IGBT MODULE, CIB 1200 V, 35 A IG	0
MG1250H-XN2MM Wickmann / Littelfuse	IGBT MOD 1200V 75A 260W	0
FS150R17PE4BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 150A 835W	0
FS15R06XL4BOMA1 IR (Infineon Technologies)	IGBT MODULE	10
FF300R12KE4EHOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 460A 1600W	0
FD16001200R17HP4KB2BOSA1 IR (Infineon Technologies)	FD1600 - IGBT MODULE	25
FP10R12W1T4PB11BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 20A 20MW	0
DDB6U100N16RRBOSA1 IR (Infineon Technologies)	IGBT, 50A, 1200V, N-CHANNEL	26
F1225R12KT4GBOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 25A 160W	10
APT150GN120J Roving Networks / Microchip Technology	IGBT MOD 1200V 215A 625W ISOTOP	11
APT45GP120JDQ2 Roving Networks / Microchip Technology	IGBT MOD 1200V 75A 329W ISOTOP	99
DF150R12RT4HOSA1 IR (Infineon Technologies)	DFXR12I - IGBT MODULE	1067
FP25R12W2T4BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 39A 175W	4
FP15R12W1T4PBPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 30A 20MW	27
FP25R12KT3BPSA1 IR (Infineon Technologies)	LOW POWER ECONO	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability