Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
FD600R06ME3S2BOSA1 IR (Infineon Technologies)	IGBT MOD 600V 600A 2250W	0
FF300R12KT4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 450A 1600W	58
6MS20017E43W37032NOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 1200A	0
FS200R07N3E4RB11BOSA1 IR (Infineon Technologies)	IGBT MOD 650V 200A 600W	0
FP25R12W2T4PB11BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 50A 20MW	0
FZ600R17KE3HOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 840A 3150W	56
2LS20017E42W40403NOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 20A	0
APT65GP60J Roving Networks / Microchip Technology	IGBT MOD 600V 130A 431W ISOTOP	10
FS50R12W1T7B11BOMA1 IR (Infineon Technologies)	IGBT MODULE LOW POWER EASY	24
FD300R12KS4HOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 370A 1950W	0
FS35R12W1T4BOMA1 IR (Infineon Technologies)	IGBT MOD 1200V 65A 225W	119
FP75R12KT4B11BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 75A 385W	66
FF450R17ME3BOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 605A 2250W	0
FZ800R33KF2CNOSA1 IR (Infineon Technologies)	IGBT MOD 3300V 1300A 9600W	0
FF1000R17IE4DPB2BOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 1000A	0
FF225R12ME4PBPSA1 IR (Infineon Technologies)	IGBT MODULE	41
APTGT150A60T1G Roving Networks / Microchip Technology	IGBT MODULE 600V 225A 480W SP1	0
FP30R06YE3B4BOMA1 IR (Infineon Technologies)	IGBT MODULE LOW PWR EASY2-1	0
FS100R12N2T4PBPSA1 IR (Infineon Technologies)	IGBT MODULE LOW POWER ECONO	0
APTGT100TL60T3G Roving Networks / Microchip Technology	IGBT MODULE 600V 150A 340W SP3	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability