Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
APT50GF120JRD Roving Networks / Microchip Technology	IGBT NPT COMBI 1200V 50A ISOTOP	60
FF900R12IP4VBOSA1 IR (Infineon Technologies)	FF900R12 - INSULATED GATE BIPOLA	0
FD1200R17HP4KB2BOSA2 IR (Infineon Technologies)	IGBT MODULE 1700V 1200A	0
APTGT200A120G Roving Networks / Microchip Technology	IGBT MODULE 1200V 280A 890W SP6	24
FMG1G100US60H	IGBT, 100A, 600V, N-CHANNEL	60
FZ800R45KL3B5NOSA2 IR (Infineon Technologies)	FZ800R45 - IGBT MODULE	54
NXH50C120L2C2ESG Sanyo Semiconductor/ON Semiconductor	IGBT MODULE, CIB 1200 V, 50 A IG	0
FD200R12KE3HOSA1 IR (Infineon Technologies)	IGBT MODULE 1200V 1050W	40
FS15R06XE3BOMA1 IR (Infineon Technologies)	IGBT MOD 600V 22A 71.5W	0
FP25R12KT4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 25A 160W	0
APT30GP60JDQ1 Microsemi	IGBT MODULE 600V 67A 245W ISOTOP	0
APT100GT120JU2 Roving Networks / Microchip Technology	IGBT MOD 1200V 140A 480W SOT227	127
FP150R07N3E4BOSA1 IR (Infineon Technologies)	IGBT MOD 650V 150A 430W	0
FF300R17ME4B11BOSA1 IR (Infineon Technologies)	FF300R17 - IGBT MODULE	10
FS820R08A6P2BPSA1 IR (Infineon Technologies)	IGBT MODULE PACK DRV HYBRIDD-1	0
F3L400R10W3S7FB11BPSA1 IR (Infineon Technologies)	IGBT MODULE LOW POWER EASY	0
FB20R06W1E3BOMA1 IR (Infineon Technologies)	IGBT MODULE 600V 29A 94W	0
APT50GF120JRDQ3 Roving Networks / Microchip Technology	IGBT MOD 1200V 120A 521W ISOTOP	0
CM100TX-24S1 Powerex, Inc.	IGBT MOD 1200V 100A 625W	12
FF200R33KF2CNOSA1 IR (Infineon Technologies)	IGBT MODULE	9

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability