Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
BUK7604-40A,118 Nexperia	MOSFET N-CH 40V 75A D2PAK	5600
2N7002P,215 Nexperia	MOSFET N-CH 60V 360MA TO236AB	170483
BUK7Y3R5-40E,115 Nexperia	MOSFET N-CH 40V 100A LFPAK56	0
PMPB12EPX Nexperia	MOSFET P-CH 30V 7.9A DFN2020MD-6	2657
PSMN4R8-100PSEQ Nexperia	MOSFET N-CH 100V 120A TO220AB	3402
PSMN3R9-60PSQ Nexperia	MOSFET N-CH 60V 130A TO220AB	0
BUK961R6-40E,118 Nexperia	MOSFET N-CH 40V 120A D2PAK	4123
PXN018-30QLJ Nexperia	PXN018-30QL/SOT8002/MLPAK33	3000
PSMN130-200D,118 Nexperia	MOSFET N-CH 200V 20A DPAK	1029
PSMN2R0-30PL,127 Nexperia	MOSFET N-CH 30V 100A TO220AB	313
BSH111BKR Nexperia	MOSFET N-CH 55V 210MA TO236AB	1599
PMN16XNEX Nexperia	MOSFET N-CH 20V 6.9A 6TSOP	8930
BUK7Y12-55B,115 Nexperia	MOSFET N-CH 55V 61.8A LFPAK56	0
BUK9225-55A,118 Nexperia	MOSFET N-CH 55V 43A DPAK	42997
PMN40ENEX Nexperia	MOSFET N-CH 30V 5.7A 6TSOP	2801
PMPB23XNEZ Nexperia	MOSFET N-CH 20V 7A 6DFN	0
BUK7S1R0-40HJ Nexperia	MOSFET N-CH 40V 325A LFPAK88	2273
PSMN5R0-40MLHX Nexperia	MOSFET N-CH 40V 85A LFPAK33	1500
PXN8R3-30QLJ Nexperia	PXN8R3-30QL/SOT8002/MLPAK33	3000
PMXB120EPEZ Nexperia	MOSFET P-CH 30V 2.4A DFN1010D-3	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS