Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
MCQ4435-TP

MCQ4435-TP

Micro Commercial Components (MCC)

MOSFET P-CH 30V 9.1A 8SOP

0

MCQ4822-TP

MCQ4822-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 8.5A 8SOP

0

SI2305B-TP

SI2305B-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 4.2A SOT23

20

SI01P10-TP

SI01P10-TP

Micro Commercial Components (MCC)

MOSFET P-CH 100V 1A SOT23

2870

2SK3018-TP

2SK3018-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 100MA SOT323

2394

MCAC10H03-TP

MCAC10H03-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 100A DFN5060-8

9975

SI3415-TP

SI3415-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 4A SOT-23

0

2N7002T-TP

2N7002T-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 115MA SOT523

2083

MCU07N65-TP

MCU07N65-TP

Micro Commercial Components (MCC)

MOSFET N-CH 650V 7A DPAK

2173

SI1012-TP

SI1012-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 500MA SOT523

1123

SI3139KE-TP

SI3139KE-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 660MA SOT523

0

MCB85N06Y-TP

MCB85N06Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 85A D2PAK

3155

MCS2305B-TP

MCS2305B-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 8.2A 8TSSOP

4457

MCB150N06YB-TP

MCB150N06YB-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 150A D2PAK

1042

SI2310-TP

SI2310-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 3A SOT23

0

MCMN2012-TP

MCMN2012-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 12A DFN2020-6J

1903

MCQ08N06-TP

MCQ08N06-TP

Micro Commercial Components (MCC)

N-CHANNEL MOSFET, SOP-8 PACKAGE

8000

MCM1208-TP

MCM1208-TP

Micro Commercial Components (MCC)

MOSFET P-CH 12V 8A DFN2020-6J

0

MCU80N03-TP

MCU80N03-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 80A DPAK

2137

SI2301A-TP

SI2301A-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 2.8A SOT23

31938

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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