Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
MCU60N04A-TP

MCU60N04A-TP

Micro Commercial Components (MCC)

N-CHANNEL MOSFET, DPAK

5000

MCAC10H045Y-TP

MCAC10H045Y-TP

Micro Commercial Components (MCC)

N-CHANNEL MOSFET, DFN5060 PACKAG

25000

SI2304-TP

SI2304-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 2.5A SOT23

1816

MCT06P10-TP

MCT06P10-TP

Micro Commercial Components (MCC)

MOSFET P-CH 100V 6A SOT223

4144

SI3420A-TP

SI3420A-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 6A SOT-23

0

SI2312-TP

SI2312-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 5A SOT23

1148

SI2302A-TP

SI2302A-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 3A SOT23

0

MCP07N65-BP

MCP07N65-BP

Micro Commercial Components (MCC)

MOSFET N-CH 650V 7A TO220AB

4654

SI2101-TP

SI2101-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 1.4A SOT323

9527

MCU90N06A-TP

MCU90N06A-TP

Micro Commercial Components (MCC)

N-CHANNEL MOSFET, DPAK

0

SI3139K-TP

SI3139K-TP

Micro Commercial Components (MCC)

MOSFET P-CH 20V 660MA SOT723

1278

MCB70N10Y-TP

MCB70N10Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 100V 70A D2PAK

0

MCAC50N10Y-TP

MCAC50N10Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 100V 50A DFN5060

29966

2N7002KA-TP

2N7002KA-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 340MA SOT23

2654

SI3400A-TP

SI3400A-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 5.8A SOT23

0

2N7002K-TP

2N7002K-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 340MA SOT23

48908

MCU10N10-TP

MCU10N10-TP

Micro Commercial Components (MCC)

MOSFET N-CH 100V 9.6A DPAK

29942

SI3401A-TP

SI3401A-TP

Micro Commercial Components (MCC)

MOSFET P-CH 30V 4.2A SOT23

15957

MCAC30N06Y-TP

MCAC30N06Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 30A DFN5060

5000

MCU12P10-TP

MCU12P10-TP

Micro Commercial Components (MCC)

MOSFET P-CH 100V 12A DPAK

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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