Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
BSS138W-TP

BSS138W-TP

Micro Commercial Components (MCC)

MOSFET N-CH 50V 220MA SOT323

2377

MSJPF20N65-BP

MSJPF20N65-BP

Micro Commercial Components (MCC)

MOSFET N-CH 650V 11A TO220F

2970

MCAC80N06Y-TP

MCAC80N06Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 80A DFN5060

13642

SI2324A-TP

SI2324A-TP

Micro Commercial Components (MCC)

MOSFET N-CH 100V 2A SOT23

51

SI3134K-TP

SI3134K-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 750MA SOT723

274

2N7002KT-TP

2N7002KT-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 340MA SOT23

0

MCU60N04-TP

MCU60N04-TP

Micro Commercial Components (MCC)

MOSFET N-CH 40V 60A DPAK

3335

MCQ9435-TP

MCQ9435-TP

Micro Commercial Components (MCC)

MOSFET P-CH 30V 5.1A 8SOP

6266

SI2102-TP

SI2102-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 2.1A SOT323

35260

MSJP20N65-BP

MSJP20N65-BP

Micro Commercial Components (MCC)

MOSFET N-CH TO220AB

4688

SI3407-TP

SI3407-TP

Micro Commercial Components (MCC)

MOSFET P-CH 30V 4.1A SOT23

2985

MCU80N03A-TP

MCU80N03A-TP

Micro Commercial Components (MCC)

MOSFET N-CH 30V 80A DPAK

1457

SI2307-TP

SI2307-TP

Micro Commercial Components (MCC)

MOSFET P-CH 30V 2.7A SOT23

633

MCB130N10Y-TP

MCB130N10Y-TP

Micro Commercial Components (MCC)

MOSFET N-CH 100V 130A D2PAK

27140

MCQ4953-TP

MCQ4953-TP

Micro Commercial Components (MCC)

MOSFET P-CH 30V 5.1A 8SOP

3607

MCU80N06A-TP

MCU80N06A-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 80A DPAK

53

MCAC80N045Y-TP

MCAC80N045Y-TP

Micro Commercial Components (MCC)

N-CHANNEL MOSFET, DFN5060 PACKAG

30000

MCU30N02-TP

MCU30N02-TP

Micro Commercial Components (MCC)

MOSFET N-CH 20V 30A DPAK

2177

SI2305-TP

SI2305-TP

Micro Commercial Components (MCC)

MOSFET P-CH 8V 4.1A SOT23

8025

2N7002W-TP

2N7002W-TP

Micro Commercial Components (MCC)

MOSFET N-CH 60V 115MA SOT-323

17025

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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