Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
MCP87022T-U/MF

MCP87022T-U/MF

Roving Networks / Microchip Technology

MOSFET N-CH 25V 100A 8PDFN

0

TP2640N3-G

TP2640N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 400V 180MA TO92-3

0

MIC94031BM4 TR

MIC94031BM4 TR

Roving Networks / Microchip Technology

MOSFET P-CH 16V 1A SOT-143

0

TP5335K1-G-VAO

TP5335K1-G-VAO

Roving Networks / Microchip Technology

MOSFET P-CH 350V 85MA SOT23-3

0

APT5010JFLL

APT5010JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 500V 41A ISOTOP

0

APT4M120K

APT4M120K

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 5A TO220

0

MCP87050T-U/MF

MCP87050T-U/MF

Roving Networks / Microchip Technology

MOSFET N-CH 25V 100A 8PDFN

0

APT50MC120JCU2

APT50MC120JCU2

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 71A SOT227

0

MIC94052BC6-TR

MIC94052BC6-TR

Roving Networks / Microchip Technology

MOSFET P-CH 6V 2A SC70-6

0

APL1001J

APL1001J

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 18A ISOTOP

0

TN2130K1-G-VAO

TN2130K1-G-VAO

Roving Networks / Microchip Technology

MOSFET N-CH 300V 85MA SOT23-3

0

MSC750SMA170B4

MSC750SMA170B4

Roving Networks / Microchip Technology

TRANS SJT 1700V TO247-4

0

APT1001R1BN

APT1001R1BN

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 10.5A TO247AD

0

APT1001RBN

APT1001RBN

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 11A TO247AD

0

CC1202

CC1202

Roving Networks / Microchip Technology

MOSFET N-CH 800V 13A TO247

0

APT5020BNFR

APT5020BNFR

Roving Networks / Microchip Technology

MOSFET N-CH 500V 28A TO247AD

0

MIC94031CYW

MIC94031CYW

Roving Networks / Microchip Technology

MOSFET P-CH 16V 1A

0

APT5020BN

APT5020BN

Roving Networks / Microchip Technology

MOSFET N-CH 500V 28A TO247AD

0

APTC90SKM60CT1G

APTC90SKM60CT1G

Roving Networks / Microchip Technology

MOSFET N-CH 900V 59A SP1

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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