Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
DN2540N3-G-P003

DN2540N3-G-P003

Roving Networks / Microchip Technology

MOSFET N-CH 400V 120MA TO92

1642

APT30M40JVFR

APT30M40JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 300V 70A ISOTOP

0

APT6021BFLLG

APT6021BFLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 29A TO247

0

APT9M100B

APT9M100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 9A TO247

0

VN2222LL-G-P013

VN2222LL-G-P013

Roving Networks / Microchip Technology

MOSFET N-CH 60V 230MA TO92-3

0

APT21M100J

APT21M100J

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 21A ISOTOP

11

TP2540N3-G-P002

TP2540N3-G-P002

Roving Networks / Microchip Technology

MOSFET P-CH 400V 86MA TO92-3

0

LND150N3-G

LND150N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30MA TO92-3

1130

TN5325K1-G

TN5325K1-G

Roving Networks / Microchip Technology

MOSFET N-CH 250V 150MA TO236AB

3058

APT66F60B2

APT66F60B2

Roving Networks / Microchip Technology

MOSFET N-CH 600V 70A T-MAX

19

TP5335K1-G

TP5335K1-G

Roving Networks / Microchip Technology

MOSFET P-CH 350V 85MA TO236AB

40854

APT8030LVRG

APT8030LVRG

Roving Networks / Microchip Technology

MOSFET N-CH 800V 27A TO264

0

TN0610N3-G

TN0610N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 100V 500MA TO92-3

697

DN1509N8-G

DN1509N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 90V 360MA TO243AA

553

VN2460N3-G

VN2460N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 600V 160MA TO92-3

158

APT29F80J

APT29F80J

Roving Networks / Microchip Technology

MOSFET N-CH 800V 31A ISOTOP

0

APT1003RBLLG

APT1003RBLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 4A TO247

0

APT50M65LLLG

APT50M65LLLG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 67A TO264

0

APT6013JLL

APT6013JLL

Roving Networks / Microchip Technology

MOSFET N-CH 600V 39A ISOTOP

0

VN10KN3-G-P003

VN10KN3-G-P003

Roving Networks / Microchip Technology

MOSFET N-CH 60V 310MA TO92-3

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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