Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TN2524N8-G

TN2524N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 240V 360MA TO243AA

0

VN2410L-G-P014

VN2410L-G-P014

Roving Networks / Microchip Technology

MOSFET N-CH 240V 190MA TO92-3

0

DN2540N3-G

DN2540N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 400V 120MA TO92

1447

MSC100SM70JCU3

MSC100SM70JCU3

Roving Networks / Microchip Technology

TRANS SJT N-CH 700V 124A SOT227

0

APT94N65B2C6

APT94N65B2C6

Roving Networks / Microchip Technology

MOSFET N-CH 650V 95A T-MAX

0

LND250K1-G

LND250K1-G

Roving Networks / Microchip Technology

MOSFET N-CH 500V 13MA SOT23

1976

MSC40SM120JCU3

MSC40SM120JCU3

Roving Networks / Microchip Technology

TRANS SJT N-CH 1.2KV 55A SOT227

54

TN2510N8-G

TN2510N8-G

Roving Networks / Microchip Technology

MOSFET N-CH 100V 730MA TO243AA

1932

APT10090SLLG

APT10090SLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 12A D3PAK

0

APT26F120B2

APT26F120B2

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 27A T-MAX

0

APT42F50S

APT42F50S

Roving Networks / Microchip Technology

MOSFET N-CH 500V 42A D3PAK

0

APT10025JVR

APT10025JVR

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 34A ISOTOP

0

APT20M45SVFRG

APT20M45SVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 56A D3PAK

0

APT10021JFLL

APT10021JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 37A ISOTOP

0

TP2535N3-G

TP2535N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 350V 86MA TO92-3

743

APT6013LLLG

APT6013LLLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 43A TO264

0

APT106N60B2C6

APT106N60B2C6

Roving Networks / Microchip Technology

MOSFET N-CH 600V 106A T-MAX

2

APT5017BVRG

APT5017BVRG

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30A TO247

0

APT60N60SCSG/TR

APT60N60SCSG/TR

Roving Networks / Microchip Technology

MOSFET N-CH 600V 60A D3PAK

0

VP0550N3-G

VP0550N3-G

Roving Networks / Microchip Technology

MOSFET P-CH 500V 54MA TO92-3

110

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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