Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
CSD25481F4

CSD25481F4

Texas Instruments

MOSFET P-CH 20V 2.5A 3PICOSTAR

301349000

CSD17313Q2T

CSD17313Q2T

Texas Instruments

MOSFET N-CH 30V 5A 6WSON

2338

TPIC5423LDW

TPIC5423LDW

Texas Instruments

N-CHANNEL POWER MOSFET

5164

CSD18531Q5AT

CSD18531Q5AT

Texas Instruments

MOSFET N-CH 60V 100A 8VSON

1634

CSD19533Q5A

CSD19533Q5A

Texas Instruments

MOSFET N-CH 100V 100A 8VSON

0

CSD17559Q5

CSD17559Q5

Texas Instruments

CSD17559Q5 30V, N CHANNEL NEXFET

1528

CSD23202W10T

CSD23202W10T

Texas Instruments

MOSFET P-CH 12V 2.2A 4DSBGA

18785

CSD25481F4T

CSD25481F4T

Texas Instruments

MOSFET P-CH 20V 2.5A 3PICOSTAR

0

TPS1100PW

TPS1100PW

Texas Instruments

MOSFET P-CH 15V 1.27A 8TSSOP

600

CSD25202W15

CSD25202W15

Texas Instruments

MOSFET P-CH 20V 4A 9DSBGA

0

CSD16327Q3T

CSD16327Q3T

Texas Instruments

MOSFET N-CH 25V 60A 8VSON

941

TPIC1501ADWR

TPIC1501ADWR

Texas Instruments

N-CHANNEL POWER MOSFET

18000

CSD18532Q5B

CSD18532Q5B

Texas Instruments

MOSFET N-CH 60V 100A 8VSON

9166

CSD17551Q3A

CSD17551Q3A

Texas Instruments

CSD17551Q3A 30V N-CHANNEL MOSFET

53029

CSD23382F4T

CSD23382F4T

Texas Instruments

MOSFET P-CH 12V 3.5A 3PICOSTAR

7270

CSD19536KTTT

CSD19536KTTT

Texas Instruments

MOSFET N-CH 100V 200A DDPAK

419

CSD16408Q5C

CSD16408Q5C

Texas Instruments

MOSFET N-CH 25V 22A/113A 8VSON

12500

CSD16414Q5

CSD16414Q5

Texas Instruments

MOSFET N-CH 25V 34A/100A 8VSON

3251

CSD17507Q5A

CSD17507Q5A

Texas Instruments

MOSFET N-CH 30V 13A/65A 8VSON

4054

CSD18509Q5B

CSD18509Q5B

Texas Instruments

MOSFET N-CH 40V 100A 8VSON

1288

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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