Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
CSD23381F4

CSD23381F4

Texas Instruments

MOSFET P-CH 12V 2.3A 3PICOSTAR

84049

CSD16322Q5C

CSD16322Q5C

Texas Instruments

MOSFET N-CH 25V 21A/97A 8VSON

10000

FDP032N08

FDP032N08

Texas Instruments

120A, 75V, 0.0032OHM, N CHANNEL

0

TPS1100DR

TPS1100DR

Texas Instruments

MOSFET P-CH 15V 1.6A 8SOIC

1064

CSD15380F3

CSD15380F3

Texas Instruments

MOSFET N-CH 20V 500MA 3PICOSTAR

12463

CSD13381F4T

CSD13381F4T

Texas Instruments

MOSFET N-CH 12V 2.1A 3PICOSTAR

126

CSD16410Q5A

CSD16410Q5A

Texas Instruments

MOSFET N-CH 25V 16A/59A 8VSON

1006

CSD16401Q5

CSD16401Q5

Texas Instruments

MOSFET N-CH 25V 38A/100A 8VSON

1555

CSD19532Q5BT

CSD19532Q5BT

Texas Instruments

MOSFET N-CH 100V 100A 8VSON

24

CSD16323Q3

CSD16323Q3

Texas Instruments

MOSFET N-CH 25V 21A/60A 8VSON

86598

CSD18532Q5BT

CSD18532Q5BT

Texas Instruments

MOSFET N-CH 60V 100A 8VSON

8320

TPS1101DR

TPS1101DR

Texas Instruments

MOSFET P-CH 15V 2.3A 8SOIC

0

CSD18534Q5AT

CSD18534Q5AT

Texas Instruments

MOSFET N-CHANNEL 60V 50A 8VSON

11

CSD17551Q5A

CSD17551Q5A

Texas Instruments

MOSFET N-CH 30V 48A 8VSON

15140

CSD18513Q5A

CSD18513Q5A

Texas Instruments

MOSFET N-CH 40V 124A 8VSON

2660

CSD18503Q5A

CSD18503Q5A

Texas Instruments

MOSFET N-CH 40V 19A/100A 8VSON

0

CSD13306W

CSD13306W

Texas Instruments

MOSFET N-CH 12V 3.5A 6DSBGA

2903

CSD13380F3

CSD13380F3

Texas Instruments

MOSFET N-CH 12V 3.6A 3PICOSTAR

47311

CSD17553Q5A

CSD17553Q5A

Texas Instruments

MOSFET N-CH 30V 23.5A/100A 8VSON

5025

CSD17579Q5AT

CSD17579Q5AT

Texas Instruments

MOSFET N-CH 30V 25A 8VSON

1499

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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