Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
CSD25485F5T

CSD25485F5T

Texas Instruments

MOSFET P-CH 20V 5.3A 3PICOSTAR

0

CSD17578Q5AT

CSD17578Q5AT

Texas Instruments

MOSFET N-CH 30V 25A 8VSON

1119

CSD18536KCS

CSD18536KCS

Texas Instruments

MOSFET N-CH 60V 200A TO220-3

232

CSD25310Q2T

CSD25310Q2T

Texas Instruments

MOSFET P-CH 20V 20A 6WSON

2250

CSD17483F4T

CSD17483F4T

Texas Instruments

MOSFET N-CH 30V 1.5A 3PICOSTAR

622

CSD16407Q5C

CSD16407Q5C

Texas Instruments

OXIDE SEMICONDUCTOR FET

9703

CSD25211W1015

CSD25211W1015

Texas Instruments

MOSFET P-CH 20V 3.2A 6DSBGA

1265

CSD17313Q2

CSD17313Q2

Texas Instruments

MOSFET N-CH 30V 5A 6WSON

3975

CSD17552Q3A

CSD17552Q3A

Texas Instruments

MOSFET N-CH 30V 15A/60A 8SON

1460

CSD13303W1015

CSD13303W1015

Texas Instruments

MOSFET N-CH 12V 31A 6DSBGA

165000

CSD17311Q5

CSD17311Q5

Texas Instruments

MOSFET N-CH 30V 32A/100A 8VSON

3586

CSD18501Q5A

CSD18501Q5A

Texas Instruments

MOSFET N-CH 40V 22A/100A 8VSON

52628

CSD18540Q5BT

CSD18540Q5BT

Texas Instruments

MOSFET N-CH 60V 100A 8VSON

9610

TPIC5403DW

TPIC5403DW

Texas Instruments

N-CHANNEL POWER MOSFET

778

CSD18543Q3A

CSD18543Q3A

Texas Instruments

MOSFET N-CH 60V 60A 8VSON

13240

CSD16570Q5BT

CSD16570Q5BT

Texas Instruments

MOSFET N-CH 25V 100A 8VSON

2826

CSD25483F4T

CSD25483F4T

Texas Instruments

MOSFET P-CH 20V 1.6A 3PICOSTAR

7174

CSD18535KTT

CSD18535KTT

Texas Instruments

MOSFET N-CH 60V 200A DDPAK

558

CSD19533KCS

CSD19533KCS

Texas Instruments

MOSFET N-CH 100V 100A TO220-3

2399

CSD22204W

CSD22204W

Texas Instruments

MOSFET P-CH 8V 5A 9DSBGA

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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