Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
RMW200N03TB ROHM Semiconductor	MOSFET N-CH 30V 20A 8PSOP	4774
RS1E300GNTB ROHM Semiconductor	MOSFET N-CH 30V 30A 8-HSOP	20
RQ6E045SNTR ROHM Semiconductor	MOSFET N-CH 30V 4.5A TSMT6	2990
RHP020N06T100 ROHM Semiconductor	MOSFET N-CH 60V 2A MPT3	10555
RS3E135BNGZETB ROHM Semiconductor	MOSFET N-CHANNEL 30V 9.5A 8SOP	0
RD3U040CNTL1 ROHM Semiconductor	MOSFET N-CH 250V 4A TO252	9
R6509ENJTL ROHM Semiconductor	MOSFET N-CH 650V 9A LPTS	90
R6006JNJGTL ROHM Semiconductor	MOSFET N-CH 600V 6A LPTS	1098
RQ6E045TNTR ROHM Semiconductor	MOSFET N-CH 30V 4.5A TSMT6	3518
R6006KND3TL1 ROHM Semiconductor	MOSFET N-CH 600V 6A TO252	2470
RSR025N03HZGTL ROHM Semiconductor	MOSFET N-CH 30V 2.5A TSMT3	0
RUC002N05HZGT116 ROHM Semiconductor	MOSFET N-CH 50V 200MA SST3	2478
RSS095N05FU6TB ROHM Semiconductor	MOSFET N-CH 45V 9.5A 8SOP	1897
RSH065N06TB1 ROHM Semiconductor	MOSFET N-CH 60V 6.5A 8SOP	2350
RQ6E055BNTCR ROHM Semiconductor	MOSFET N-CH 30V 5.5A TSMT6	114
RSD221N06TL ROHM Semiconductor	MOSFET N-CH 60V 22A CPT3	0
RAL045P01TCR ROHM Semiconductor	MOSFET P-CH 12V 4.5A TUMT6	2990
RDD022N60TL ROHM Semiconductor	MOSFET N-CH 600V 2A CPT3	0
RRF015P03TL ROHM Semiconductor	MOSFET P-CH 30V 1.5A TUMT3	0
SCT3060AW7TL ROHM Semiconductor	TRANS SJT N-CH 650V 38A TO263-7	990

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS