Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFK220N15P

IXFK220N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 220A TO264AA

3375

IXFP7N80PM

IXFP7N80PM

Wickmann / Littelfuse

MOSFET N-CH 800V 3.5A TO220AB

1000

IXFB150N65X2

IXFB150N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 150A PLUS264

2071100

IXFN160N30T

IXFN160N30T

Wickmann / Littelfuse

MOSFET N-CH 300V 130A SOT227B

342

IXFT150N17T2

IXFT150N17T2

Wickmann / Littelfuse

MOSFET N-CH 175V 150A TO268HV

780

IXFR80N60P3

IXFR80N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 48A ISOPLUS247

3540

IXFX64N60P3

IXFX64N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 64A PLUS247-3

259

IXFH56N30X3

IXFH56N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 56A TO247

429540

IXFK120N65X2

IXFK120N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 120A TO264

74

IXTH02N250

IXTH02N250

Wickmann / Littelfuse

MOSFET N-CH 2500V 200MA TO247

286870

IXFX360N10T

IXFX360N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 360A PLUS247-3

20570

IXTK180N15P

IXTK180N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 180A TO264

503100

IXFK250N10P

IXFK250N10P

Wickmann / Littelfuse

MOSFET N-CH 100V 250A TO264AA

0

IXTP3N100D2

IXTP3N100D2

Wickmann / Littelfuse

MOSFET N-CH 1000V 3A TO220AB

66450

IXTH32N65X

IXTH32N65X

Wickmann / Littelfuse

MOSFET N-CH 650V 32A TO247

0

IXKH35N60C5

IXKH35N60C5

Wickmann / Littelfuse

MOSFET N-CH 600V 35A TO247AD

0

IXTY01N100D

IXTY01N100D

Wickmann / Littelfuse

MOSFET N-CH 1000V 100MA TO252

10349

IXTP10N60P

IXTP10N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 10A TO220AB

850

IXTN62N50L

IXTN62N50L

Wickmann / Littelfuse

MOSFET N-CH 500V 62A SOT227B

0

IXFR26N100P

IXFR26N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 15A ISOPLUS247

3270

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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