Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXTA80N10T

IXTA80N10T

Wickmann / Littelfuse

MOSFET N-CH 100V 80A TO263

22325700

IXTQ26N50P

IXTQ26N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 26A TO3P

318

IXFX120N30P3

IXFX120N30P3

Wickmann / Littelfuse

MOSFET N-CH 300V 120A PLUS247-3

60

IXTT120N15P

IXTT120N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 120A TO268

120

IXTP10P15T

IXTP10P15T

Wickmann / Littelfuse

MOSFET P-CH 150V 10A TO220AB

3550

IXFT120N30X3HV

IXFT120N30X3HV

Wickmann / Littelfuse

MOSFET N-CH 300V 120A TO268HV

450

IXFR44N50Q

IXFR44N50Q

Wickmann / Littelfuse

MOSFET N-CH 500V 34A ISOPLUS247

0

IXKN40N60C

IXKN40N60C

Wickmann / Littelfuse

MOSFET N-CH 600V 40A SOT-227B

1170

IXTH360N055T2

IXTH360N055T2

Wickmann / Littelfuse

MOSFET N-CH 55V 360A TO247

1020

IXFN80N50Q2

IXFN80N50Q2

Wickmann / Littelfuse

MOSFET N-CH 500V 72A SOT227B

0

IXTP36P15P

IXTP36P15P

Wickmann / Littelfuse

MOSFET P-CH 150V 36A TO220AB

284

IXTA3N50D2-TRL

IXTA3N50D2-TRL

Wickmann / Littelfuse

MOSFET N-CH 500V 3A TO263

0

IXTH1N170DHV

IXTH1N170DHV

Wickmann / Littelfuse

MOSFET N-CH 1700V 1A TO247HV

720

IXFT36N50P

IXFT36N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 36A TO268

2580

IXFH15N100Q3

IXFH15N100Q3

Wickmann / Littelfuse

MOSFET N-CH 1000V 15A TO247AD

450

IXTA34N65X2-TRL

IXTA34N65X2-TRL

Wickmann / Littelfuse

MOSFET N-CH 650V 34A TO263

0

IXFX300N20X3

IXFX300N20X3

Wickmann / Littelfuse

MOSFET N-CH 200V 300A PLUS247-3

256

IXFH96N15P

IXFH96N15P

Wickmann / Littelfuse

MOSFET N-CH 150V 96A TO247AD

0

IXFP72N20X3M

IXFP72N20X3M

Wickmann / Littelfuse

MOSFET N-CH 200V 72A TO220

631550

IXFP14N85XM

IXFP14N85XM

Wickmann / Littelfuse

MOSFET N-CHANNEL 850V 14A TO220

100178650

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top