Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
IXFR26N120P

IXFR26N120P

Wickmann / Littelfuse

MOSFET N-CH 1200V 15A ISOPLUS247

3720

IXTQ64N25P

IXTQ64N25P

Wickmann / Littelfuse

MOSFET N-CH 250V 64A TO3P

840

IXFX78N50P3

IXFX78N50P3

Wickmann / Littelfuse

MOSFET N-CH 500V 78A PLUS247-3

480

IXFT40N85XHV

IXFT40N85XHV

Wickmann / Littelfuse

MOSFET N-CH 850V 40A TO268

0

IXFA22N65X2

IXFA22N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 22A TO263

86

IXTP1R6N100D2

IXTP1R6N100D2

Wickmann / Littelfuse

MOSFET N-CH 1000V 1.6A TO220AB

0

IXFR44N80P

IXFR44N80P

Wickmann / Littelfuse

MOSFET N-CH 800V 25A ISOPLUS247

270

IXFR44N50P

IXFR44N50P

Wickmann / Littelfuse

MOSFET N-CH 500V 24A ISOPLUS247

4200

IXTH50P10

IXTH50P10

Wickmann / Littelfuse

MOSFET P-CH 100V 50A TO247

171

IXFA10N80P

IXFA10N80P

Wickmann / Littelfuse

MOSFET N-CH 800V 10A TO263

0

IXFH42N60P3

IXFH42N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 42A TO247AD

19630

IXTX170P10P

IXTX170P10P

Wickmann / Littelfuse

MOSFET P-CH 100V 170A PLUS247-3

1020

IXFA30N25X3

IXFA30N25X3

Wickmann / Littelfuse

MOSFET N-CHANNEL 250V 30A TO263

4050

IXFH150N30X3

IXFH150N30X3

Wickmann / Littelfuse

MOSFET N-CH 300V 150A TO247

251

IXTN600N04T2

IXTN600N04T2

Wickmann / Littelfuse

MOSFET N-CH 40V 600A SOT227B

129

IXFA8N65X2

IXFA8N65X2

Wickmann / Littelfuse

MOSFET N-CH 650V 8A TO263

2150

IXTH130N20T

IXTH130N20T

Wickmann / Littelfuse

MOSFET N-CH 200V 130A TO247

90

IXFN110N60P3

IXFN110N60P3

Wickmann / Littelfuse

MOSFET N-CH 600V 90A SOT227B

189

IXFX180N25T

IXFX180N25T

Wickmann / Littelfuse

MOSFET N-CH 250V 180A PLUS247-3

444

IXTP30N25L2

IXTP30N25L2

Wickmann / Littelfuse

MOSFET N-CH 250V 30A TO220AB

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

RFQ BOM Call Skype Email
Top