Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
CPC3708ZTR

CPC3708ZTR

Wickmann / Littelfuse

MOSFET N-CH 350V 5MA SOT223

1000

IXTA180N10T7

IXTA180N10T7

Wickmann / Littelfuse

MOSFET N-CH 100V 180A TO263-7

0

IXFR36N60P

IXFR36N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 20A ISOPLUS247

60

IXTN5N250

IXTN5N250

Wickmann / Littelfuse

MOSFET N-CH 2500V 5A SOT227B

0

IXTQ10P50P

IXTQ10P50P

Wickmann / Littelfuse

MOSFET P-CH 500V 10A TO3P

0

IXFH6N120

IXFH6N120

Wickmann / Littelfuse

MOSFET N-CH 1200V 6A TO247AD

203930

IXFX64N60Q3

IXFX64N60Q3

Wickmann / Littelfuse

MOSFET N-CH 600V 64A PLUS247-3

0

IXFA5N100P

IXFA5N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 5A TO263

800

IXFT60N50P3

IXFT60N50P3

Wickmann / Littelfuse

MOSFET N-CH 500V 60A TO268

3330

IXFK220N20X3

IXFK220N20X3

Wickmann / Littelfuse

MOSFET N-CH 200V 220A TO264

825

IXTY02N50D

IXTY02N50D

Wickmann / Littelfuse

MOSFET N-CH 500V 200MA TO252

5180

IXFX64N50Q3

IXFX64N50Q3

Wickmann / Littelfuse

MOSFET N-CH 500V 64A PLUS247-3

0

IXTY48P05T

IXTY48P05T

Wickmann / Littelfuse

MOSFET P-CH 50V 48A TO252

0

IXTP230N075T2

IXTP230N075T2

Wickmann / Littelfuse

MOSFET N-CH 75V 230A TO220AB

0

IXTH75N10L2

IXTH75N10L2

Wickmann / Littelfuse

MOSFET N-CH 100V 75A TO247

420

IXFB40N110P

IXFB40N110P

Wickmann / Littelfuse

MOSFET N-CH 1100V 40A PLUS264

88

IXTP1N100P

IXTP1N100P

Wickmann / Littelfuse

MOSFET N-CH 1000V 1A TO220AB

0

IXTA08N100D2-TRL

IXTA08N100D2-TRL

Wickmann / Littelfuse

MOSFET N-CH 1000V 800MA TO263

1600

IXFT52N50P2

IXFT52N50P2

Wickmann / Littelfuse

MOSFET N-CH 500V 52A TO268

2670

IXFH26N60P

IXFH26N60P

Wickmann / Littelfuse

MOSFET N-CH 600V 26A TO247AD

277

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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