Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
C3M0065090D

C3M0065090D

Wolfspeed - a Cree company

SICFET N-CH 900V 36A TO247-3

0

C3M0120090J

C3M0120090J

Wolfspeed - a Cree company

SICFET N-CH 900V 22A D2PAK-7

0

C3M0032120J1

C3M0032120J1

Wolfspeed - a Cree company

1200V 32MOHM SIC MOSFET

0

C2M1000170D

C2M1000170D

Wolfspeed - a Cree company

SICFET N-CH 1700V 4.9A TO247-3

0

C2M0080120D

C2M0080120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 36A TO247-3

5436

C3M0120090J-TR

C3M0120090J-TR

Wolfspeed - a Cree company

SICFET N-CH 900V 22A D2PAK-7

0

C3M0065090J-TR

C3M0065090J-TR

Wolfspeed - a Cree company

SICFET N-CH 900V 35A D2PAK-7

0

C3M0280090J-TR

C3M0280090J-TR

Wolfspeed - a Cree company

SICFET N-CH 900V 11A D2PAK-7

0

C2M0025120D

C2M0025120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 90A TO247-3

1158

C3M0075120D

C3M0075120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 30A TO247-3

0

E3M0120090D

E3M0120090D

Wolfspeed - a Cree company

SICFET N-CH 900V 23A TO247-3

422

C3M0160120J

C3M0160120J

Wolfspeed - a Cree company

SICFET N-CH 1200V 17A TO263-7

539

C3M0065100K

C3M0065100K

Wolfspeed - a Cree company

SICFET N-CH 1000V 35A TO247-4L

0

C3M0030090K

C3M0030090K

Wolfspeed - a Cree company

SICFET N-CH 900V 63A TO247-4

6169

C3M0065100J

C3M0065100J

Wolfspeed - a Cree company

SICFET N-CH 1000V 35A D2PAK-7

0

C3M0032120D

C3M0032120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 63A TO247-3

0

C3M0025065K

C3M0025065K

Wolfspeed - a Cree company

GEN 3 650V 25 M SIC MOSFET

385

C2M0045170D

C2M0045170D

Wolfspeed - a Cree company

SICFET N-CH 1700V 72A TO247-3

0

C3M0021120D

C3M0021120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 100A TO247-3

0

C3M0060065D

C3M0060065D

Wolfspeed - a Cree company

SICFET N-CH 650V 37A TO247-3

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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