Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
C3M0032120K

C3M0032120K

Wolfspeed - a Cree company

SICFET N-CH 1200V 63A TO247-4L

354

C3M0040120D

C3M0040120D

Wolfspeed - a Cree company

1200V 40MOHM SIC MOSFET

0

C3M0045065D

C3M0045065D

Wolfspeed - a Cree company

GEN 3 650V 45 M SIC MOSFET

339

C3M0350120J

C3M0350120J

Wolfspeed - a Cree company

SICFET N-CH 1200V 7.2A TO263-7

874

C3M0075120J

C3M0075120J

Wolfspeed - a Cree company

SICFET N-CH 1200V 30A D2PAK-7

0

C3M0015065K

C3M0015065K

Wolfspeed - a Cree company

SICFET N-CH 650V 120A TO247-4L

0

C3M0016120D

C3M0016120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 115A TO247-3

0

C3M0280090D

C3M0280090D

Wolfspeed - a Cree company

SICFET N-CH 900V 11.5A TO247-3

0

E3M0280090D

E3M0280090D

Wolfspeed - a Cree company

SICFET N-CH 900V 11.5A TO247-3

38

C2M0280120D

C2M0280120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 10A TO247-3

0

C3M0016120K

C3M0016120K

Wolfspeed - a Cree company

SICFET N-CH 1.2KV 115A TO247-4

0

C3M0120100J

C3M0120100J

Wolfspeed - a Cree company

SICFET N-CH 1000V 22A D2PAK-7

0

C2M1000170J

C2M1000170J

Wolfspeed - a Cree company

SICFET N-CH 1700V 5.3A D2PAK

0

C3M0120100K

C3M0120100K

Wolfspeed - a Cree company

SICFET N-CH 1000V 22A TO247-4L

208

C3M0120065D

C3M0120065D

Wolfspeed - a Cree company

650V 120M SIC MOSFET

431

C3M0021120K

C3M0021120K

Wolfspeed - a Cree company

SICFET N-CH 1200V 100A TO247-4L

0

C3M0350120D

C3M0350120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 7.6A TO247-3

56

C3M0075120J-TR

C3M0075120J-TR

Wolfspeed - a Cree company

SICFET N-CH 1200V 30A TO263-7

0

C3M0065100J-TR

C3M0065100J-TR

Wolfspeed - a Cree company

SICFET N-CH 1000V 35A TO263-7

0

CMF10120D

CMF10120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 24A TO247

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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