Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
C3M0015065D

C3M0015065D

Wolfspeed - a Cree company

SICFET N-CH 650V 120A TO247-3

0

E3M0065090D

E3M0065090D

Wolfspeed - a Cree company

SICFET N-CH 900V 35A TO247-3

0

C3M0060065J

C3M0060065J

Wolfspeed - a Cree company

SICFET N-CH 650V 36A TO263-7

0

C3M0025065D

C3M0025065D

Wolfspeed - a Cree company

GEN 3 650V 25 M SIC MOSFET

321

C3M0060065K

C3M0060065K

Wolfspeed - a Cree company

SICFET N-CH 650V 37A TO247-4L

0

C2M0080170P

C2M0080170P

Wolfspeed - a Cree company

SICFET N-CH 1700V 40A TO247-4

0

C3M0065090J

C3M0065090J

Wolfspeed - a Cree company

SICFET N-CH 900V 35A D2PAK-7

0

C3M0075120K

C3M0075120K

Wolfspeed - a Cree company

SICFET N-CH 1200V 30A TO247-4L

0

E3M0120090J

E3M0120090J

Wolfspeed - a Cree company

900V 120M AUTOMOTIVE SIC MOSFET

0

C3M0120065J

C3M0120065J

Wolfspeed - a Cree company

650V 120M SIC MOSFET

0

C2M0160120D

C2M0160120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 19A TO247-3

577

C3M0045065K

C3M0045065K

Wolfspeed - a Cree company

GEN 3 650V 45 M SIC MOSFET

238

C3M0280090J

C3M0280090J

Wolfspeed - a Cree company

SICFET N-CH 900V 11A D2PAK-7

0

C3M0120065K

C3M0120065K

Wolfspeed - a Cree company

650V 120M SIC MOSFET

440

C3M0040120K

C3M0040120K

Wolfspeed - a Cree company

1200V 40MOHM SIC MOSFET

0

C2M0045170P

C2M0045170P

Wolfspeed - a Cree company

SICFET N-CH 1700V 72A TO247-4

2

C3M0160120D

C3M0160120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 17A TO247-3

0

C3M0120090D

C3M0120090D

Wolfspeed - a Cree company

SICFET N-CH 900V 23A TO247-3

4627

C2M0040120D

C2M0040120D

Wolfspeed - a Cree company

SICFET N-CH 1200V 60A TO247-3

0

C2M1000170J-TR

C2M1000170J-TR

Wolfspeed - a Cree company

SICFET N-CH 1700V 5.3A D2PAK-7

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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