Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIHG23N60E-GE3

SIHG23N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 23A TO247AC

263

IRFR420APBF

IRFR420APBF

Vishay / Siliconix

MOSFET N-CH 500V 3.3A DPAK

34

SI3437DV-T1-GE3

SI3437DV-T1-GE3

Vishay / Siliconix

MOSFET P-CH 150V 1.4A 6TSOP

850

IRFDC20PBF

IRFDC20PBF

Vishay / Siliconix

MOSFET N-CH 600V 320MA 4DIP

1311

SI8821EDB-T2-E1

SI8821EDB-T2-E1

Vishay / Siliconix

MOSFET P-CH 30V 4MICROFOOT

194

SI4638DY-T1-E3

SI4638DY-T1-E3

Vishay / Siliconix

MOSFET N-CH 30V 22.4A 8SO

0

IRFBC20PBF-BE3

IRFBC20PBF-BE3

Vishay / Siliconix

MOSFET N-CH 600V 2.2A TO220AB

1000

SIHD6N80E-GE3

SIHD6N80E-GE3

Vishay / Siliconix

MOSFET N-CH 800V 5.4A DPAK

2925

SIHB11N80E-GE3

SIHB11N80E-GE3

Vishay / Siliconix

MOSFET N-CH 800V 12A D2PAK

0

SQP50N06-09L_GE3

SQP50N06-09L_GE3

Vishay / Siliconix

MOSFET N-CH 60V 50A TO220AB

850

SQM50P03-07_GE3

SQM50P03-07_GE3

Vishay / Siliconix

MOSFET P-CHANNEL 30V 50A TO263

700

SI3433CDV-T1-GE3

SI3433CDV-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 6A 6TSOP

11275

SI8406DB-T2-E1

SI8406DB-T2-E1

Vishay / Siliconix

MOSFET N-CH 20V 16A 6MICRO FOOT

9

IRF830BPBF

IRF830BPBF

Vishay / Siliconix

MOSFET N-CH 500V 5.3A TO220AB

705

IRLR014TRL

IRLR014TRL

Vishay / Siliconix

MOSFET N-CH 60V 7.7A DPAK

0

SUD08P06-155L-BE3

SUD08P06-155L-BE3

Vishay / Siliconix

MOSFET P-CH 60V 8.2A DPAK

1983

IRFZ14SPBF

IRFZ14SPBF

Vishay / Siliconix

MOSFET N-CH 60V 10A D2PAK

1136

IRFIZ34GPBF

IRFIZ34GPBF

Vishay / Siliconix

MOSFET N-CH 60V 20A TO220-3

410

SISH114ADN-T1-GE3

SISH114ADN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 18A/35A PPAK

6050

IRF830ASTRLPBF

IRF830ASTRLPBF

Vishay / Siliconix

MOSFET N-CH 500V 5A D2PAK

2350

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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