Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SQD23N06-31L_GE3

SQD23N06-31L_GE3

Vishay / Siliconix

MOSFET N-CH 60V 23A TO252

662

SQM35N30-97_GE3

SQM35N30-97_GE3

Vishay / Siliconix

MOSFET N-CH 300V 35A TO263

210

SI3465DV-T1-GE3

SI3465DV-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 3A 6TSOP

0

SIHJ690N60E-T1-GE3

SIHJ690N60E-T1-GE3

Vishay / Siliconix

MOSFET N-CH 600V 5.6A PPAK SO-8

3015

SIA436DJ-T1-GE3

SIA436DJ-T1-GE3

Vishay / Siliconix

MOSFET N-CH 8V 12A PPAK SC70-6

35941

SI2307BDS-T1-GE3

SI2307BDS-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 2.5A SOT23-3

9296

SIHP17N80E-GE3

SIHP17N80E-GE3

Vishay / Siliconix

MOSFET N-CH 800V 15A TO220AB

977

SQM50034EL_GE3

SQM50034EL_GE3

Vishay / Siliconix

MOSFET N-CH 60V 100A TO263

775

SI7850DP-T1-GE3

SI7850DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 60V 6.2A PPAK SO-8

6610

SUD23N06-31-T4-GE3

SUD23N06-31-T4-GE3

Vishay / Siliconix

MOSFET N-CH 60V 21.4A TO252

2466

SIR470DP-T1-GE3

SIR470DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 40V 60A PPAK SO-8

4990

SIA445EDJT-T1-GE3

SIA445EDJT-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 12A PPAK SC70-6

0

SQJ420EP-T1_GE3

SQJ420EP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 40V 30A PPAK SO-8

1161

SI7726DN-T1-GE3

SI7726DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 35A PPAK1212-8

0

SIHG100N60E-GE3

SIHG100N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 30A TO247AC

515

SIHD6N80AE-GE3

SIHD6N80AE-GE3

Vishay / Siliconix

MOSFET N-CH 800V 5A DPAK

5549

SIR696DP-T1-GE3

SIR696DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 125V 60A PPAK SO-8

2141

IRFR9210TRLPBF

IRFR9210TRLPBF

Vishay / Siliconix

MOSFET P-CH 200V 1.9A DPAK

0

SI1416EDH-T1-GE3

SI1416EDH-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 3.9A SOT-363

34263

IRFR1N60ATRLPBF

IRFR1N60ATRLPBF

Vishay / Siliconix

MOSFET N-CH 600V 1.4A DPAK

2988

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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