Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIHP22N60AE-GE3

SIHP22N60AE-GE3

Vishay / Siliconix

MOSFET N-CH 600V 20A TO220AB

0

SI4403DDY-T1-GE3

SI4403DDY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 15.4A 8SOIC

24

IRFR214PBF-BE3

IRFR214PBF-BE3

Vishay / Siliconix

MOSFET N-CH 250V 2.2A DPAK

2980

SIHG20N50E-GE3

SIHG20N50E-GE3

Vishay / Siliconix

MOSFET N-CH 500V 19A TO247AC

0

IRF820SPBF

IRF820SPBF

Vishay / Siliconix

MOSFET N-CH 500V 2.5A D2PAK

693

SUD50N04-8M8P-4BE3

SUD50N04-8M8P-4BE3

Vishay / Siliconix

MOSFET N-CH 40V 14A/50A DPAK

2497

SIHU4N80AE-GE3

SIHU4N80AE-GE3

Vishay / Siliconix

MOSFET N-CH 800V 4.3A IPAK

3000

SI3457CDV-T1-E3

SI3457CDV-T1-E3

Vishay / Siliconix

MOSFET P-CH 30V 5.1A 6TSOP

2433

SI1302DL-T1-GE3

SI1302DL-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 600MA SC70-3

3372

SUD09P10-195-BE3

SUD09P10-195-BE3

Vishay / Siliconix

MOSFET P-CH 100V 8.8A DPAK

1982

SI4874BDY-T1-GE3

SI4874BDY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 12A 8SO

0

IRLR014TRLPBF

IRLR014TRLPBF

Vishay / Siliconix

MOSFET N-CH 60V 7.7A DPAK

0

SIHH070N60EF-T1GE3

SIHH070N60EF-T1GE3

Vishay / Siliconix

MOSFET N-CH 600V 36A PPAK 8 X 8

2280

SIJ462DP-T1-GE3

SIJ462DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 60V 46.5A PPAK SO-8

2669

SQJ444EP-T1_GE3

SQJ444EP-T1_GE3

Vishay / Siliconix

MOSFET N-CH 40V 60A PPAK SO-8

7

SISS92DN-T1-GE3

SISS92DN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 250V 3.4A/12.3A PPAK

52

SUP85N15-21-E3

SUP85N15-21-E3

Vishay / Siliconix

MOSFET N-CH 150V 85A TO220AB

6

SQJ418EP-T2_GE3

SQJ418EP-T2_GE3

Vishay / Siliconix

MOSFET N-CH 100V 48A PPAK SO-8

0

SIHD2N80AE-GE3

SIHD2N80AE-GE3

Vishay / Siliconix

MOSFET N-CH 800V 2.9A DPAK

3047

SIRA18ADP-T1-GE3

SIRA18ADP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 30.6A PPAK SO-8

10941

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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