Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SISS65DN-T1-GE3

SISS65DN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 25.9A/94A PPAK

6280

IRFZ44PBF

IRFZ44PBF

Vishay / Siliconix

MOSFET N-CH 60V 50A TO220AB

5850

SIHG47N60E-GE3

SIHG47N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 47A TO247AC

58

SIR570DP-T1-RE3

SIR570DP-T1-RE3

Vishay / Siliconix

N-CHANNEL 150 V (D-S) MOSFET POW

0

SI3460BDV-T1-GE3

SI3460BDV-T1-GE3

Vishay / Siliconix

MOSFET N-CH 20V 8A 6TSOP

1446

SIHH14N65E-T1-GE3

SIHH14N65E-T1-GE3

Vishay / Siliconix

MOSFET N-CH 650V 15A PPAK 8 X 8

5951

SIA471DJ-T1-GE3

SIA471DJ-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 12.9A/30.3A PPAK

3757

SUP90N06-6M0P-E3

SUP90N06-6M0P-E3

Vishay / Siliconix

MOSFET N-CH 60V 90A TO220AB

19

SIHP11N80AE-GE3

SIHP11N80AE-GE3

Vishay / Siliconix

MOSFET N-CH 800V 8A TO220AB

1035

IRFI840GPBF

IRFI840GPBF

Vishay / Siliconix

MOSFET N-CH 500V 4.6A TO220-3

206

SIR880ADP-T1-GE3

SIR880ADP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 80V 60A PPAK SO-8

1602

IRFD9120PBF

IRFD9120PBF

Vishay / Siliconix

MOSFET P-CH 100V 1A 4DIP

17874

SUP70101EL-GE3

SUP70101EL-GE3

Vishay / Siliconix

MOSFET P-CH 100V 120A TO220AB

0

SIRA88BDP-T1-GE3

SIRA88BDP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 19A/40A PPAK SO8

6040

SI7788DP-T1-GE3

SI7788DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 50A PPAK SO-8

0

SQD07N25-350H_GE3

SQD07N25-350H_GE3

Vishay / Siliconix

MOSFET N-CH 250V 7A TO252AA

1274

SISA72ADN-T1-GE3

SISA72ADN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 40V 25.4A/94A PPAK

3578

SI2308CDS-T1-GE3

SI2308CDS-T1-GE3

Vishay / Siliconix

MOSFET N-CH 60V 2.6A SOT23-3

0

IRFD113PBF

IRFD113PBF

Vishay / Siliconix

MOSFET N-CH 60V 800MA 4DIP

1637

SI7374DP-T1-E3

SI7374DP-T1-E3

Vishay / Siliconix

MOSFET N-CH 30V 24A PPAK SO-8

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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