Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIHP38N60E-GE3

SIHP38N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 43A TO220AB

541

SI2342DS-T1-GE3

SI2342DS-T1-GE3

Vishay / Siliconix

MOSFET N-CH 8V 6A SOT-23

0

SI7386DP-T1-GE3

SI7386DP-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 12A PPAK SO-8

8476

SUD25N15-52-E3

SUD25N15-52-E3

Vishay / Siliconix

MOSFET N-CH 150V 25A TO252

3215

SIHF6N40D-E3

SIHF6N40D-E3

Vishay / Siliconix

MOSFET N-CH 400V 6A TO220

999

SIHP38N60EF-GE3

SIHP38N60EF-GE3

Vishay / Siliconix

MOSFET N-CH 600V 40A TO220AB

0

SI4174DY-T1-GE3

SI4174DY-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 17A 8SO

4157

IRFBC30ALPBF

IRFBC30ALPBF

Vishay / Siliconix

MOSFET N-CH 600V 3.6A I2PAK

0

SQS482EN-T1_GE3

SQS482EN-T1_GE3

Vishay / Siliconix

MOSFET N-CH 30V 16A PPAK1212-8

2668

SI2304DDS-T1-BE3

SI2304DDS-T1-BE3

Vishay / Siliconix

MOSFET N-CH 30V 3.3A/3.6A SOT23

2970

IRFD9220PBF

IRFD9220PBF

Vishay / Siliconix

MOSFET P-CH 200V 560MA 4DIP

239

SUM110N04-03P-E3

SUM110N04-03P-E3

Vishay / Siliconix

MOSFET N-CH 40V 110A TO263

0

SIHB22N60ET1-GE3

SIHB22N60ET1-GE3

Vishay / Siliconix

MOSFET N-CH 600V 21A TO263

790

SI7116BDN-T1-GE3

SI7116BDN-T1-GE3

Vishay / Siliconix

MOSFET N-CH 40V 18.4A/65A PPAK

50

SI4431BDY-T1-E3

SI4431BDY-T1-E3

Vishay / Siliconix

MOSFET P-CH 30V 5.7A 8SO

27098

SIR800ADP-T1-RE3

SIR800ADP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 20V 50.2A/177A PPAK

5259

IRF610PBF-BE3

IRF610PBF-BE3

Vishay / Siliconix

MOSFET N-CH 200V 3.3A TO220AB

804

IRL640PBF-BE3

IRL640PBF-BE3

Vishay / Siliconix

MOSFET N-CH 200V 17A TO220AB

1350

SIR826BDP-T1-RE3

SIR826BDP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 80V 19.8A/80.8A PPAK

5858

SI7615ADN-T1-GE3

SI7615ADN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 20V 35A PPAK1212-8

56044

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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